
- Get in Touch with Us
Last Updated: Apr 25, 2025 | Study Period: 2024-2030
Die Attach Film is an adhesive film used in the manufacturing of semiconductors. It is known as Dicing Die Attach Film because it is paired with dicing tape.
The process of attaching a semiconductor die to a package, a substrate like a PCB board, or another die is known as die attach or die bonding. The die attach procedure is crucial to many different kinds of packaging. PbSn, PbSnAg, or PbInAg alloys are common materials for die attachment.
Due to the production of intermetallic compounds, which provide an adhesive layer between the substrate or die metallization and bulk solder, these alloys wet conventional substrates and die metallizations.
A semiconductor die is attached to a package, a substrate like a PCB board, or another die using a technique called die attach or die bonding. For many different kinds of packaging, the die attach procedure is essential. Die Attach Film is an adhesive film used in the semiconductor manufacturing process.
Dicing Die Attach Film is what it is known as when it is paired with dicing tape. Die attach techniques, such as epoxy, eutectic, soft solder, and flip chip, are used to attach the semiconductor chip to the packaging and satisfy the stringent functional specifications of the most cutting-edge semiconductor devices.
The Global film die attach machine market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Henkel releases the groundbreaking movie Die Attach machine. Henkel has created and made commercially accessible a series of new Ablestik brand die attach materials known as self-filleting die attach film, further enhancing the capabilities of contemporary die attach technology.
The new generation of die attach solutions provide all the advantages of conventional die attach pastes while advancing adhesive technology by including a self-filleting mechanism, which makes them an attractive and significantly less expensive alternative to other die attach films.
A press and a die work together to shape and size the material according to the specifications of the die.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introdauction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in theIndustry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |