GLOBAL FLEXIBLE SIC-BASED POWER MODULE MARKET

INTRODUCTION

 A power module that employs a Silicon Carbide semiconductor as switches is known as a Flexible Silicon Carbide power module. Electrical power, which is the result of current and voltage, is transformed with high conversion efficiency using a silicon carbide power module.

Wide band-gap semiconductor silicon carbide is utilized in MOSFETs because it has very low switching losses, which enables greater switching frequencies compared to conventional silicon devices. Furthermore, compared to conventional Si semiconductors, it can work at higher temperatures and voltages.

GLOBAL FLEXIBLE SIC-BASED POWER MODULE MARKET SIZE AND FORECAST

The Global Flexible SiC-based power module market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

NEW PRODUCT LAUNCH

Two new STPOWER modules with common configurations of 1200V silicon-carbide (SiC) MOSFETs were launched by STMicroelectronics. The ST ACEPACK 2 package, which can deliver high power density and facilitate simple assembly, is used for both modules.

The first of the new modules, the A2F12M12W2-F1, is a four-pack module that offers an efficient and portable full-bridge solution for circuits like DC/DC converters. The A2U12M12W2-F2 is the alternate module, and it utilises a three-level T-type topology to combine high conduction and switching efficiency with dependable output voltage.

 The first of the new modules, the A2F12M12W2-F1, is a four-pack module that offers an efficient and portable full-bridge solution for circuits like DC/DC converters. The other module, the A2U12M12W2-F2, employs a three-level T-type transistor to combine high conduction and switching efficiency with dependable output voltage.

Both the full-bridge and T-type topologies can manage high-power applications with a typical RDS(on) of 13m per die and offer good energy efficiency with easier thermal control because of less dissipation.

 The ACEPACK 2 package's tiny size and high power density are due to direct bonded copper (DBC) die attachment and a suitable alumina substrate. Electric vehicles (EVs), power conversion for charging stations, energy storage, and solar energy are a few examples of equipment that may be exposed to harsh environments.

Press fit pins are used for the external connections to make assembly easier. An integrated NTC temperature sensor for system protection and diagnostics is part of the kit, which provides insulation up to 2.5 kVrms.

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Flexible SiC-based power modules are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Flexible SiC-based power module and key vendor selection criteria
3. Where is the Flexible SiC-based power module manufactured? What is the average margin per unit?
4. Market share of Global Flexible SiC-based power module market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Flexible SiC-based power module in-house
6. key predictions for next 5 years in Global Flexible SiC-based power module market
7. Average B-2-B Flexible SiC-based power module market price in all segments
8. Latest trends in Flexible SiC-based power module market, by every market segment
9. The market size (both volume and value) of the Flexible SiC-based power module market in 2023-2030 and every year in between?
10. Production breakup of Flexible SiC-based power module market, by suppliers and their OEM relationship