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Last Updated: Apr 25, 2025 | Study Period: 2022-2027
FPGAs (field-programmable gate arrays) are semiconductor devices that are made up of a matrix of customizable logic blocks (CLB) coupled with programmable interconnects.
After the manufacturing process, FPGAs can be programmed to meet the needs of the applications in which they will be employed.
FPGAs are distinguished from application-specific integrated circuits (ASICs) by their post-manufacture programmability. ASICs are built expressly for the applications in which they will be utilised.
FPGAs have also suited for high-performance computing (HPC) applications due to their hardware acceleration capabilities. These applications demand higher performance than current CPUs can give.
The usage of FPGAs in HPC applications solves performance, productivity, power, and cost challenges. They have low-cost hardware, can accelerate algorithms, and are simple to build and install.
The growing need for efficient computing, greater scalability, dependability, and storage, as well as the deployment of HPC in the cloud, are projected to drive development.
The Global FPGA Configuration Devices Market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2026, registering a CAGR of XX% from 2022 to 2027.
Write-protected flash memory secures the configuration data in Acromag's new XMC-7AWP and XMC-7KWP modules with a user-programmable Xilinx Artix-7 or Kintex-7 FPGA. Hardware simulation, communications, signal intelligence,
adaptive filtering and image processing are just a few of the uses for these components. PCIe, 10GbE, LVDS, serial, and other I/O signals all have high-speed interfaces.Kintex-7 FPGAs with 325k or 410k logic cells are available in the XMC-7KWP versions.
10-gigabit Ethernet with fibre or copper transceivers is supported via dual SFP+ ports. JTAG, USB, global differential clock pairs, and LVDS signals are all provided through a 36-pin VHDCR connection to the FPGA.
The rear I/O XMC port supports SelectIO channels for single-ended or differential I/O and has a 4-lane high-speed serial interface.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2027 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2027 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2027 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2027 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |