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Last Updated: Apr 25, 2025 | Study Period: 2022-2027
Most modern smartphones and tablets are equipped with low-power chips that are based on designs from a UK chip manufacturer.
Companies are becoming more interested in employing mobile CPUs in servers as they try to lower data-center power costs. Some believe that smartphone chips are well-suited for workloads involving large numbers of little transactions, such as serving search results and handling "likes" on social networks.
For software that demands higher performance, such as huge database applications and ERP (enterprise resource planning) systems, stronger chips like the Xeon and Opteron are seen to be the best.
For those who are very concerned about a phone's performance, the CPU ranking list of phones can be used to evaluate a phone directly.
The Germany Smartphone Chipset Market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2026, registering a CAGR of XX% from 2022 to 2027.
The next generation of 5G smartphones will be powered by MediaTek's Dimensity 1050 system-on-chip [SoC], the company's first mmWave 5G chipset, which offers seamless connection, displays, gaming, and power efficiency.
The Dimensity 1050 will provide the speeds and capacity necessary to give smartphone users an outstanding experience, even in some of the densestly populated places, with dual connectivity using mmWave and sub-6GHz.
With faster, more dependable connections and cutting-edge camera technology, the Dimensity 1050 chip delivers potent features to help device manufacturers to differentiate their smartphone product lines.
Its combination of sub-6GHz and mmWave technologies will deliver end-to-end 5G experiences, uninterrupted connectivity, and superior power efficiency to meet everyday user demands.
The Dimensity 1050 delivers Wi-Fi optimizations in addition to 5G optimizations and MediaTek's HyperEngine 5.0 gaming technology to guarantee lower-latency connections with the new tri-band (2.4GHz, 5GHz, and 6GHz) that increases game duration and performance.
Additionally, ultra-fast data streams for accelerating apps, social feeds, and higher frame rates in games are ensured by high-end UFS 3.1 storage and LPDDR5 memory.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2027 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2027 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2027 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2027 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |