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Last Updated: Apr 25, 2025 | Study Period:
SiC was originally identified in meteorites dating back more than 4.6 billion years, making it older than our solar system. But it hasn't been until recently that SiC has reached a level of industrialization that makes it both technically and commercially feasible for it to compete with silicon in the manufacture of power semiconductors.
Combining silicon (Si) and carbon (C), silicon carbide has distinct electrical properties that make it possible to create high-performance semiconductors for a variety of applications.
A power module that employs silicon carbide semiconductors as switches is known as a silicon carbide power module.Electrical power, which is the result of current and voltage, is transformed with high conversion efficiency using a silicon carbide power module.
When utilized in MOSFETs, silicon carbide, a semiconductor with a wide band-gap and very low switching losses, enables higher switching frequencies compared to conventional silicon devices. In contrast to conventional Si semiconductors, it can work at higher temperatures and at higher voltages.
Due to SiC power semiconductors' essential efficiency properties, which enable cost savings while simultaneously boosting system performance in a number of applications such as EV chargers, solar inverters, e-mobility, and motor drives, it is anticipated that their use would increase dramatically.
The Global Silicon Carbide Power Modules market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The advantages of tried-and-true industry standard power modules are combined with SEMIKRON packaging technology in SEMIKRON's hybrid SiC and SiC MOSFET power modules. All of silicon carbide's advantages can be fully utilized because of numerous packaging improvements.
SiC MOSFETs can switch at maximum speed thanks to a low module commutation inductance. Smaller magnetic filter components can be produced by converting the greater switching speeds into higher switching frequencies. The switching losses can be decreased at the same time, improving system effectiveness.
Higher power densities are made possible by sophisticated materials and packaging techniques that reduce the thermal resistance of the chip to the heatsink. Modules for silicon carbide power Applications for solar inverters use three-level topologies for the maximum efficiency, including ANPC and flying capacitor boosters.
Energy storage systems: 2- and 3-level topologies with highest efficiency and minimal noise,high-performance double conversion systems (UPS),Active front end and motor inverter with hybrid, SiC MOSFET sixpacks, and half-bridges are examples of motor drives.Power sources: extra power for induction heating, traction applications, etc.
New Silicon-Carbide Power Modules for Traction Applications in Electric Vehicles are Launched by STMicroelectronics. For usage in the E-GMP electric vehicle platform, which is shared by the KIA EV6 and a number of other models, Hyundai has chosen the five new SiC-MOSFET based power modules.
The development of traction applications for electric vehicles is the main focus of the new modules' design. The modules are available as part of ST's ACEPACK DRIVE package and are perfect for EV drives. The primary power semiconductors are ST's third-generation (Gen3) STPOWER SiC MOSFETs, which provide synchronous rectification, low switching energy, (RDS(ON) x die area), and low switching resistance.
These semiconductors are located inside the solution.Future generations of EVs will be built using ST silicon carbide solutions, which allow major automakers to set the pace for electrification.
Their third-generation SiC technology ensures the greatest power density and energy efficiency, resulting in superior vehicle performance, range, and charge time. Longer range is made possible by their traction inverters' use of SiC-MOSFET-based power modules from ST.
Utilising ST's ongoing technological investment to position itself as the leading semiconductor player in the electrification revolution, the collaboration between these two firms has realised a key step towards more environmentally friendly electric vehicles.
Faster charging, improved vehicle dynamics, and more energy efficiency are all made possible by ST's STPOWER SiC devices, which are created as compact SiC devices that can tolerate greater operating voltages.
The modules use the thermally efficient and mechanically robust active metal brazed (AMB) substrate technology, installing a separate NTC for each substrate. Additionally, they come with an option of welded or screw-fit busbar, providing flexibility to meet various mounting needs.
The use of a Hall sensor to monitor the motor current is made possible by a long-busbar option, which increases versatility even further. Additionally serving as a partner to Renault is STMicroelectronics. A strategic alliance has been formed between the two parties.
The collaboration aims to enhance the performance of the electric and hybrid vehicles produced by the Renault Group that use wide bandgap semiconductor technologies from STMicroelectronics. Under the motto "Wide Bandgap," the chip manufacturer is promoting the release of components made of cutting-edge materials like gallium nitride or silicon carbide.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |