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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
A multi-chip package is a type of electronic packaging that combines several integrated circuits (ICs) into a single device. An MCP is a single component that is capable of handling a whole function.
An MCP's numerous components are put on a substrate, and the substrate's bare dies are attached to the surface using wire bonding, tape bonding, or flip-chip bonding.
A plastic molding can encase the module, which is then put on the printed circuit board. MCPs provide superior performance and can significantly reduce the size of a device.
The Global UFS-based MCP (uMCP) Market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2026, registering a CAGR of XX% from 2022 to 2027.
Samsung Electronics unveiled a new multi-chip package (MCP) memory solution for 5G smartphones, as the South Korean tech giant attempts to better target the fast-growing handset industry.
The world's leading memory chip manufacturer said that mass production of the low-power double data rate 5 (LPDDR5) universal flash storage (UFS) MCP, which combines high-performance DRAM and NAND flash memory chips in a single compact package, has commenced.
Samsung's LPDDR5 mobile DRAM has a read/write speed of 25 gigabytes per second (GB/s), which is 1.5 times faster than the previous LPDDR4X, and the performance of UFS 3.1 interface-based NAND flash has been doubled to 3GB/s compared to the previous UFS 2.2 solution.
Samsung will offer a variety of storage capacity options to satisfy the needs of its clients, ranging from 6GB to 12GB of DRAM and 128GB to 512GB of NAND flash.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type,2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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