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A multi-chip package is a type of electronic packaging that combines several integrated circuits (ICs) into a single device. An MCP is a single component that is capable of handling a whole function.
An MCP’s numerous components are put on a substrate, and the substrate’s bare dies are attached to the surface using wire bonding, tape bonding, or flip-chip bonding.
A plastic molding can encase the module, which is then put on the printed circuit board. MCPs provide superior performance and can significantly reduce the size of a device.
The Global UFS-based MCP (uMCP) Market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2026, registering a CAGR of XX% from 2022 to 2027.
Samsung Electronics unveiled a new multi-chip package (MCP) memory solution for 5G smartphones, as the South Korean tech giant attempts to better target the fast-growing handset industry.
The world’s leading memory chip manufacturer said that mass production of the low-power double data rate 5 (LPDDR5) universal flash storage (UFS) MCP, which combines high-performance DRAM and NAND flash memory chips in a single compact package, has commenced.
Samsung’s LPDDR5 mobile DRAM has a read/write speed of 25 gigabytes per second (GB/s), which is 1.5 times faster than the previous LPDDR4X, and the performance of UFS 3.1 interface-based NAND flash has been doubled to 3GB/s compared to the previous UFS 2.2 solution.
Samsung will offer a variety of storage capacity options to satisfy the needs of its clients, ranging from 6GB to 12GB of DRAM and 128GB to 512GB of NAND flash.
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