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Last Updated: Apr 26, 2025 | Study Period: 2023-2030
INTRODUCTION
Printed circuit board with minimal halogen components is known as a halogen free PCB. Chlorine, fluorine, bromine, astatine, and iodine are the main halogen elements that are toxic to life. There is less than 900 ppm of bromine or chlorine in a halogen-free PCB. The board's halogen content is also under 1500 ppm.
Halogen-free cables have materials that have not undergone any processing involving any halogen elements. Halogens, such as chlorine, are great insulators because they are non-conductors, and as a result, they are frequently used as the material for cable jackets.Both chlorine and bromine have many advantages.
Chlorine is a flame-retardant that safeguards a PCB's componentry. For this reason, halogen-containing flame retardants are used on a lot of printed circuit boards, including FR4 and CEM3 PCB.
Wire coating also uses chlorine as an element. Bromine, on the other hand, is a sterilant. Additionally, it serves as a flame retardant.Halogen-free PCB substrates have better electrical insulation.
P and N have smaller polarity than halogens, and thus halogen-free materials have reduced polarity compared with bromine-containing materials. For this reason, halogen-free PCBs can withstand a higher electric shock.
Global halogen free PCB market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
NEW PRODUCT LAUNCH
ITEQ Corporation announced the launch of its brand-new halogen-free IT-88GMW product for use in emerging 5G, millimetre wave, and automotive radar applications.
The product is the lowest loss item in this group of thermoset products, with a nominal dielectric constant of 2.98 and a dissipation factor of 0.0012 at 10 GHz.
The product will be offered with a full range of prepreg materials to enable high layer count boards, as well as as a standalone copper-clad laminate in hybrid applications for use in automotive driver-assist systems.IT-88GMW is suitable for high layer count backplane applications, as it offers very low skew and very low loss.
The glass transition temperature is in excess of 170° C and the product has a decomposition temperature of around 405° C. Copper profile with Rz values ~2 micrometers will be used as standard on the product. The product will be manufactured in ITEQâs state-of-the-art facility in Taiwan and distributed globally.
S.NO | Overview of Development | Details of Development |
1. | Isola Shows Halogen-Free PCBs at DesignCon | Halogen-free PCBs were displayed at DesignCon by Isola Group, a world authority in advanced circuit materials for printed circuit boards (PCBs). The newest low-loss circuit materials from Isola Group will be unveiled.The halogen-free circuit materials for RF and microwave circuit applications are improved versions of Isola's conventional halogen-free circuit materials. The new circuit materials are built on specially chosen glass fibers and ultra-smooth copper materials to provide ultra-low-loss circuit materials perfect for high-speed-digital (HSD) and high-frequency analog circuits, which are commonly used to connect wired and wireless communications equipment and networks. |
THIS REPORT WILL ANSWER FOLLOWING QUESTIONS
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2023-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2023-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2023-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |