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Last Updated: Apr 25, 2025 | Study Period: 2023-2030
Bridge for HD video interface In order to provide interoperability between multiple high-definition (HD) video sources and displays, ICs are electrical components that span the gaps between various video interface standards. These ICs act as converters, switching video signals between formats to provide smooth video transmission and display.
Bridge for HD video interface The essential signal conversions, including format conversion, time management, synchronisation, and resolution scaling, are handled by ICs. They could also have added functions like power management, HDCP (High-bandwidth Digital Content Protection) compatibility, and audio extraction.
In order to ensure compatibility and smooth video transmission between various video sources and screens, these ICs are essential. They are frequently used in applications that need visual interface conversion, such as consumer electronics, computer systems, game consoles, digital signs, and industrial automation.
The integration of various video systems is made possible by HD video interface bridge ICs, which let users connect and use various video sources and displays without running into compatibility problems.
TheGlobal HD Video Interface Bridge ICs Marketaccounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The industry's first interface bridge IC, "TC358840XBG" from Toshiba Corporation, is now available. It translates 4K ultra HD video streams from HDMI to MIPI CSI-2 without compression or degradation. Starting in April, sample shipments will be made, and major production will follow.
The new IC outputs via twin MIPI® CSI-2 interfaces and divides a 4K ultra HD (3840 x 2160) video stream into the left and right pictures. It enables the conversion of 4K ultra HD video at high resolution and 30 frames per second, which enhances the processing of high-quality video.
The IC may be used in a variety of applications since it also allows the conversion of HDMI® audio input stream to I2S, TDM, or MIPI SLIMbus® (Serial Low-power Inter-chip Media Bus).
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
| 21 | Product installation rate by OEM, 2022 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2022 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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