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Heat dissipative thermoset molding compounds are materials that can transfer heat away from a heat source and prevent overheating of electronic devices They are composed of thermosetting resins, such as epoxy or phenolic, that are mixed with fillers, reinforcements, and additives to enhance their thermal conductivity, mechanical strength, and electrical insulation.
Heat dissipative thermoset molding compounds are used to encapsulate integrated circuits (ICs), power modules, sensors, and other electronic components that generate heat during operation They can also be used as coatings or adhesives for heat dissipation applications.
Heat dissipative thermoset molding compounds are processed by injection molding, compression molding, transfer molding, or liquid dispensing methods They undergo chemical cross-linking reactions when heated in a mold, resulting in a rigid and durable structure that cannot be remelted or reshaped.
Heat dissipation in thermoset molding compounds works by transferring the heat generated by the electronic device to the surrounding environment through conduction and convection The heat transfer depends on the thermal conductivity of the thermoset resin and the fillers, as well as the contact resistance between the device and the encapsulant.
The thermal conductivity of thermoset molding compounds can be enhanced by adding fillers such as metal powders, ceramic particles, carbon fibers, or graphene These fillers can form a network of heat paths within the resin matrix and reduce the thermal resistance However, the addition of fillers can also affect other properties of the thermoset molding compounds, such as viscosity, shrinkage, mechanical strength, electrical insulation, and cost.
The contact resistance between the device and the encapsulant can be reduced by improving the adhesion and wetting of the thermoset resin to the device surface This can be achieved by modifying the surface chemistry of the device or adding coupling agents or surfactants to the thermoset resin A good contact can also prevent air gaps or voids from forming during the molding process, which can increase the thermal resistance and cause thermal stress.
The Global Heat Dissipative Thermoset Molding Compounds market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
SUMIKON® EM-TX235 is a heat dissipative thermoset molding compound based on epoxy (TS) polymer. It is manufactured and marketed by Sumitomo Bakelite Co Ltd., a global leader in high performance plastics According to the technical data sheet, some of the features of SUMIKON® EM-TX235 are: It has a thermal conductivity of 3.6 W/mK measured by probe method.
It has a specific gravity of 1.70 and a molding shrinkage of 0.30% It has a flexural strength of 65 MPa and a flexural modulus of 14.0 GPaIt has a Charpy impact strength (notched) of 2.0 kJ/m² and a deflection temperature under load of 260°C.
It is non-electrical insulative with a volume resistivity of less than 10 6 Ω·cm It is supplied in the form of granular/molding powder for compression or transfer molding.
Sumitomo Bakelite Co., Ltd., which provides SUMIKON® EM-TX235 and also offers heat dissipative materials like thermoplastic engineering plastics (PPS) molding compounds, thermoset molding compounds (phenolic and epoxy), liquid resin (epoxy) and powder coating resin (epoxy), to meet thermal management requirement in various applications.
SBHPP, which produces a wide range of phenolic molding compounds – from commodities to fiber reinforced grades – and specialized molding compounds such as epoxy, diallyl phthalate, silicone and unsatured polyester.
Van Norman Molding which has been one of the leading producers of phenolic and thermoset composites like BMC, SMC and DMC plastic parts CHERIC, which offers thermal fatigue-resistant EMCs (Epoxy Molding Compounds) for electronic encapsulation.
