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Heat-resistant polyimide film is a high performance plastic film that has effective thermal, electrical, and mechanical properties that make it well suited for the toughest environments.
The film is relatively lightweight and transparent, allowing it to be used in a variety of applications such as insulation, electrical insulation, adhesives, mechanical components, heat sealing, and more. Its notable features include excellent dimensional stability, good electrical strength and good thermal conductivity.
Polyimide is a type of polymer that characteristically does not burn in high temperatures, making it an ideal material for aerospace and other industries where fire risk is a major concern. The film is also commonly used for lighting, medical technology, and automotive applications.
It is made up of a combination of imide/amide linkages connecting two aromatic rings, forming an incredibly strong film that also has superior resistance to UV light and most chemicals. The film is available in a variety of formats, ranging from sheets and rolls to fiber and tape, and can be tailored for almost any purpose.
Heat-resistant polyimide film is easy to fabricate and highly flexible, allowing it to be formed into specific shapes and sizes for tight tolerance, detailed jobs. In addition, the film does not emit toxic fumes or residue when exposed to intense heat and is highly conformable to surfaces, making it easy to work with and form in intricate applications.
Polyimide film can also be used in extremely low temperatures, making it an ideal material for cryogenic applications. As a result, it is an excellent choice for extreme temperature applications.
The Global Heat-Resistant Polyimide Film market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
“Pixeo IB,” a highly heat-resistant polyimide film for high-speed, high-frequency 5G, has been developed by Kaneka Corporation. Samples have been available since October, and a full-scale launch is planned. The dielectric loss tangent in high frequencies is lowered by “Pixeo IB” to 0.0025, the best result for polyimide film globally.
This was made possible by the sophisticated polyimide development technologies that Kaneka has amassed over a long period of time. This enables 5G millimetre wave zones to be handled, enabling high-speed communications.The global smartphone industry is expected to witness a strong growth in 5G models going forward, owing to the advent of 5G-equipped handsets. These smartphones are expected to achieve connection speeds around 100 times faster than 4G.
With the “Pixeo SR” handling sub-6 and the “Pixeo IB” supporting millimetre waves, Kaneka will increase sales of these materials that enable digital devices to achieve more sophisticated features and broaden their portfolio of 5G-supported products.With its extremely heat-resistant polyimide “Pixeo,” Kaneka holds a significant market share in materials that facilitate high-speed information transfer.
All the same, Kaneka keeps offering a range of options with its various polyimide products. Polyimide varnish for a TFT substrate, ultrahigh thermal conductivity graphite sheets, and clear polyimide film for flexible displays that serve as glass substitutes are some examples of these.
Toray has developed a heat-resistant, transparent film for 5G communications. Although 5G technology allows broadband cellular networks to communicate extremely quickly, it also necessitates a large number of antennas. This is because it makes use of short-range, higher frequency radio waves. This circumstance sparked research into transparent antennas that are well-visible and have a versatile design that can be mounted in a variety of spaces.
Because polyethylene terephthalate and transparent polyimide films are lightweight and indestructible, they are used in existing transparent circuit boards. But because of its high dielectric loss tangent, 5G communications suffer significant signal losses. Toray consequently eliminated these voids by combining its unique particle dispersion technology with its polymer design.
