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High-density plasma etching systems are advanced tools used in the fabrication of semiconductor devices. They are used to create the intricate patterns, through holes, and other features that are necessary to make the electronic devices work.
High-density plasma etching systems work by using a combination of high-energy ions and chemically reactive species to etch desired features in a substrate. The ions and reactive species are generated by a plasma, which is created by subjecting a gas mixture to an electric field.
This electric field breaks the gas apart, resulting in a gas of highly energised ions and neutral particles. The ions and reactive species then bombard the substrate, resulting in material etching.The etching process is highly precise, allowing for high-resolution features to be created.
The system can etch features with a high degree of accuracy and repeatability. By carefully controlling the etching process, the feature size and shape of the etching can be precisely controlled. This allows for the fabrication of high-quality semiconductor devices.
High-density plasma etching systems are highly efficient and flexible tools for fabricating semiconductor devices. They are used in a wide range of applications, from creating intricate computer chips to creating complex medical devices. They provide an excellent way to create complex and accurate features for a variety of applications.
The Global high-density plasma etching system market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Impressio 2400 PICP Pro, a plasma etch system with the new PICP Pro chamber for high-resolution operations, has been released by Tokyo Electron. It is intended to process glass substrates of the eighth generation (G8).
Large substrate areas must be etched using a high-density homogeneous plasma in order to make G8 displays, which are mostly utilized for large TVs and IT goods. Particle and other process condition management is becoming more and more important for the manufacturing of high-resolution, improved displays, such as OLEDs, as their sizes increase.
TEL has created the PICP Pro etch systems for the G8 display segment in response to industry requests. These systems have an expanded PICP Pro plasma module, which has been proven to increase yield and production stability in the G6 market.
Through the addition of a new feature to control the plasma-space-generating area, TEL’s proprietary PICP high-density plasma source, which enhances its high-precision etch performance, the PICP Pro systems can lessen the generation of particles that negatively impact yield and the maintenance cycle, resulting in lower running costs when compared to earlier PICP models.
