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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
RF, MEMS, mixed-signal, and other analog semiconductor components can be tested with this high-density source measure unit (SMU), which has six times the DC channel density of previous NI PXI SMUs.
In a form factor that is ready for production, SMU offers higher DC channel density for increased parallelism in multisite applications and laboratory-grade measurement quality.
"Exceptionally problematic innovations like 5G, the Web of Things and independent vehicles put a strain on semiconductor associations to develop and take on additional proficient ways to deal with semiconductor tests - from the lab climate to the creation floor,"
"Semiconductor test is an essential concentration for NI. In order to assist chipmakers in addressing their most pressing issues, we are expanding the capabilities of our software platform and PXI, as demonstrated by our most recent PXI SMU.
In the validation lab and on the production floor, engineers can use the same instrumentation, reducing measurement correlation difficulties and speeding up time to market.
TheGlobal High Density SMU marketaccounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The PXIe-4163 high-density source measure unit (SMU), which has six times the DC channel density of previous NI PXI SMUs and is used to test analog semiconductor components for RF, MEMS, mixed-signal, and other applications.
Semiconductor Test System (STS) has been quickly adopted by chipmakers due to its throughput, cost-effective performance, and production floor footprint.
These capabilities are further enhanced by the brand-new PXIe-4163 SMU. In a form factor that is ready for production, it provides higher DC channel density for increased parallelism in multisite applications and laboratory-grade measurement quality.
Designers can exploit this blend to involve a similar instrumentation in the approval lab and the creation floor, which decreases difficulties with estimation relationship and abbreviates time to showcase.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |