GLOBAL HIGH POWER DENSITY CHIP RESISTOR MARKET

INTRODUCTION

This specialized design benefits from improved heat transfer from the element to the terminal and is optimized for power management, actuator drive, and heating applications. By limiting the temperature rise in the component hotspot, such high power density components reduce PCB space requirements and improve reliability.

Our best power density to date is provided by TT's HPDC series' wide-area solder terminations on aluminum nitride. By limiting the component hotspot temperatures, this solution allows our customers to reduce the size of their power conversion designs while improving assembly reliability.

GLOBAL HIGH POWER DENSITY CHIP RESISTOR MARKET SIZE AND FORECAST

The Global High power density chip resistor market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.

NEW PRODUCT LAUNCH

The introduction of TT Electronics' HPDC series high power density chip resistors was announced. The improved heat transfer from the element to the terminal makes this specialized design ideal for power management, actuator drive, and heating applications.

By limiting the temperature rise in the component hotspot, the adoption of such high power density components reduces PCB space requirements and improves reliability.

The aluminum nitride (AlN) ceramic substrate used in TT's new HPDC series chip resistors has nearly six times the thermal conductivity of alumina, the traditional substrate material for chip resistors.

Large area terminations are another feature of HPDC chip resistors for better thermal contact with a PCB. In turn, this effectively conducts heat away from the resistor element, lowering temperature rise.

With values of 2.4W in 1206 and 3.5W in 2512 footprints, HPDC resistors can now provide a high power density solution. HPDC is perfect for active capacitor bleed circuits because it improves short-term overload performance at 4.7W in 1206 and 7.7W in 2512 for five seconds.

The maximum element temperature of 155°C and the maximum termination temperature of 110°C are the only temperature limits on the power that can be applied when using these high-power resistors in temperature-controlled heating applications.

COMPANY PROFILE

• Bourns Inc.
• TE Connectivity
• Vishay Intertechnology Inc.,
• Koa Corporation
• Tzai Yuan Enterprise Co.
• International Manufacturing Services

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many High Power Density Chip Resistors are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global High Power Density Chip Resistor and key vendor selection criteria
3. Where is the High Power Density Chip Resistor manufactured? What is the average margin per unit?
4. Market share of Global High Power Density Chip Resistor market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global High Power Density Chip Resistor in-house
6. key predictions for next 5 years in Global High Power Density Chip Resistor market
7. Average B-2-B High Power Density Chip Resistor market price in all segments
8. Latest trends in High Power Density Chip Resistor market, by every market segment
9. The market size (both volume and value) of the High Power Density Chip Resistor market in 2022-2030 and every year in between?
10. Production breakup of High Power Density Chip Resistor market, by suppliers and their OEM relationship