GLOBAL HYBRID BONDING SYSTEM MARKET

INTRODUCTION

To establish a direct electrical connection between two wafers or substrates, the semiconductor industry uses a bonding method known as a hybrid bonding system. To accomplish high-density interconnects and the integration of various materials or structures, it incorporates a number of bonding techniques. In semiconductor devices, hybrid bonding systems have advantages like better performance, miniaturization, and enhanced functionality.

The following steps are commonly included in the hybrid bonding process:

• Alignment: To ensure that the bonding pads or other structures are properly aligned, the two wafers or substrates to be joined are precisely aligned. 
• Activation: To improve the bonding process, the bonding surfaces are treated or activated. This may entail surface modification, cleaning, or the application of a thin adhesive coating.
• Bonding: To create the required connection, many bonding procedures are used sequentially or simultaneously. In hybrid bonding systems, common bonding techniques include Direct bonding(without the use of an intermediary layer), Anodic Bonding(electric field to bond materials like glass and silicon), Metal Bonding(using metal interconnects like gold or copper for a reliable bond)
• Processing carried out after bonding: Additional steps may be taken to improve the bond’s quality or incorporate other parts. These could involve thinned bonded wafers, planarization, or annealing.

Multiple advantages of hybrid bonding systems include:

• Integration of several materials: Hybrid bonding enables the fusion of various materials, such as silicon, glass, or polymers, each with distinct properties. This makes it possible to combine many features into a single device.
• Bonding with a fine pitch is made possible via hybrid bonding, which makes it possible to integrate many connections into a compact space. This is essential for modern semiconductor devices and high-density packaging.
• High reliability: Bonds that are strong and reliable are frequently produced via hybrid bonding systems, which combine many bonding processes. Excellent electrical and mechanical performance is ensured with the use of suitable activation and bonding techniques.
• Hybrid bonding is frequently used in 3D integration techniques, which include stacking and connecting many layers of chips or wafers. Vertical integration and effective utilization of space are made possible.

GLOBAL HYBRID BONDING SYSTEM MARKET SIZE AND FORECAST

The Global Hybrid Bonding System market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

NEW PRODUCT LAUNCH

By successfully demonstrating 100% void-free bonding yield of multiple die of various sizes from a full 3D system-on-a-chip (SoC) in a single transfer process using its GEMINI FB automated hybrid bonding system, EV Group (EVG) has made significant advancements in die-to-wafer (D2W) fusion and hybrid bonding.

Up until now, achieving such a feat had been a huge difficulty for D2W bonding and a significant roadblock to lowering the cost of heterogeneous integration implementation. This significant industry accomplishment was completed at the Heterogeneous Integration Competence Centre (HICC) of EVG, which was established to help customers leverage EVG’s process solutions and expertise to hasten the development of novel and distinctive products and applications motivated by advancements in system integration and packaging.

COMPANY PROFILE

• ASM Pacific Technology
• Besi
• Kulicke & Soffa
• Mitsubishi Heavy Industries
• Shibaura Mechatronics Corporation
• Palomar technologies

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Hybrid Bonding Systems are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Hybrid Bonding System and key vendor selection criteria
3. Where is the Hybrid Bonding System manufactured? What is the average margin per unit?
4. Market share of Global Hybrid Bonding System market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Hybrid Bonding System in-house
6. key predictions for next 5 years in Global Hybrid Bonding System market
7. Average B-2-B Hybrid Bonding System market price in all segments
8. Latest trends in Hybrid Bonding System market, by every market segment
9. The market size (both volume and value) of the Hybrid Bonding System market in 2023-2030 and every year in between?
10. Production breakup of Hybrid Bonding System market, by suppliers and their OEM relationship