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hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit, or simply hybrid is a miniaturised electronic circuit made up of individual components like passive elements like resistors, inductors, transformers, and capacitors as well as semiconductor components like transistors, diodes, or monolithic ICs.
It is particularly well suited for creating custom analogue circuits, such as A/D and D/A converters, amplifiers, and modulators, and is used in military and communications applications.
The multichip module (MCM) and later the multi chip package were developed from the hybrid microcircuit (MCP).The benefit of hybrid circuits is that they allow the use of components that cannot be used in a typical monolithic IC (or chip), such as large-value capacitors, wound components, crystals, inductors, etc.
Global hybrid integrated circuit market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
In collaboration with researchers from Harvard University and Freedom Photonics, HyperLight, a pioneer in the commercialization of thin-film lithium niobate photonic integrated circuits for datacom, telecom, analogue, and quantum applications, announced today that it has successfully demonstrated a ground-breaking method of integrating high-power lasers on such a platform.
The aforementioned hybrid platform made it possible to create the first high optical power transmitter chip, which included a high-speed thin-film lithium niobate intensity modulator from HyperLight that could operate at 60 mW output power and beyond 50 GHz electro-optic bandwidth.
A new multi-chip 3D integrated circuit (IC) planning, assembly validation, and parasitic extraction (PEX) workflow has been created and implemented by Siemens Digital Industries Software in partnership with leading semiconductor foundry United Microelectronics (UMC) for UMC’s wafer-on-wafer and chip-on-wafer technologies.
This new flow will soon be made available to UMC’s diverse customer base worldwide. Siemens’ XPEDITION Substrate Integrator software for design planning and assembly, along with Siemens’ Calibre 3DSTACK software for inter-die connectivity checking, Calibre nmDRC software, Calibre nmLVS software, and Calibre xACT software for IC and inter-die extended physical and circuit verification tasks, were used by UMC to develop its new hybrid-bonding 3D layout vs. schematic (LVS) verification and parasitic extraction workflow.
