Global IC Pick And Place Test Holder Market Size and Forecasts 2030
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Global IC Pick And Place Test Holder Market Size and Forecasts 2030

Last Updated:  Apr 25, 2025 | Study Period:

IC PICK AND PLACE TEST HOLDER MARKET

 

INTRODUCTION

A high-speed pick-and-place handler intended for high-volume multi-site IC and image sensor testing. It simulates real-world environment conditions in order to test the performance and reliability of the DUTs at temperatures ranging from 25°C to 175°C.

 

Ion Chromatography Testing provides information about cleanliness, specifically individual ionic data values, for a variety of samples, including, but not limited to, printed circuit boards, printed circuit assemblies, and soldering fluxes.

 

Handler for testing. To increase the productivity of semiconductor engineering labs, an automated IC handler with remote operation and thermal control is available.

 

The mobile electronics market today consumes large quantities of ICs that necessitate high power dissipation during device characterization and pre-production bring up. 

 

IC PICK AND PLACE TEST HOLDER MARKET  SIZE AND FORECAST

 

 IC Pick And Place Test Holder Market Size

 

The Global IC Pick and Place Test Holder market  accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

 

IC PICK AND PLACE TEST HOLDER MARKET NEW PRODUCT LAUNCH

Cohu Introduces the Next Generation Pick-and-Place Handler Cohu, Inc. (NASDAQ: COHU) announced the release of Eclipse, a high-speed pick-and-place handler capable of testing up to 16 Integrated Circuits (ICs) in parallel at temperatures up to +130 degrees Celsius and throughput up to 13,000 units per hour.

 

Eclipse provides scalable performance for singulated testing of a wide range of semiconductors, from analogue ICs with short test times that require extremely high handler throughput to large multi-site digital IC test applications.

 

The new handler supports package sizes ranging from 3x3 mm to 55x55 mm in a variety of forms such as CSP, BGA, QFP, QFN, and others.

 

The initial Eclipse configuration is intended for testing devices that power next-generation smartphones and tablets. The handler includes the company's proprietary T-Core thermal controller and an on-board liquid cooling system that provides precise, multi-site temperature management of power dissipative ICs, optimising test yield of next generation mobile processors.

 

"Eclipse is designed to meet the high-mix production requirements of test subcontractors, allowing them to leverage their existing device kit infrastructure while utilising their high performance thermal technology, which is considered the benchmark for testing mid to high power processors," The integration of T-Core into Eclipse provides customers with a scalable solution for testing both standard ICs and thermal dissipative processors in an all-in-one cost-effective handler platform.

 

 KEY PLAYER IN IC PICK AND PLACE TEST HOLDER MARKET 

 

THIS IC PICK AND PLACE TEST HOLDER MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

  1. How many IC Pick and Place Test Holder are manufactured per annum globally? Who are the sub-component suppliers in different regions?
  2. Cost breakup of a Global IC Pick and Place Test Holder and key vendor selection criteria
  3. Where is the IC Pick and Place Test Holder manufactured? What is the average margin per unit?
  4. Market share of Global IC Pick and Place Test Holder market manufacturers and their upcoming products
  5. Cost advantage for OEMs who manufacture Global IC Pick and Place Test Holder  in-house
  6. key predictions for next 5 years in Global IC Pick and Place Test Holder  market
  7. Average B-2-B IC Pick and Place Test Holder market price in all segments
  8. Latest trends in IC Pick and Place Test Holder market, by every market segment
  9. The market size (both volume and value) of the IC Pick and Place Test Holder  market in 2024-2030 and every year in between?
  10. Production breakup of IC Pick and Place Test Holder market, by suppliers and their OEM relationship

 

Sl noTopic
1Market Segmentation
2Scope of the report
3Abbreviations
4Research Methodology
5Executive Summary
6Introduction
7Insights from Industry stakeholders
8Cost breakdown of Product by sub-components and average profit margin
9Disruptive innovation in the Industry
10Technology trends in the Industry
11Consumer trends in the industry
12Recent Production Milestones
13Component Manufacturing in US, EU and China
14COVID-19 impact on overall market
15COVID-19 impact on Production of components
16COVID-19 impact on Point of sale
17Market Segmentation, Dynamics and Forecast by Geography, 2024-2030
18Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030
19Market Segmentation, Dynamics and Forecast by Application, 2024-2030
20Market Segmentation, Dynamics and Forecast by End use, 2024-2030
21Product installation rate by OEM, 2023
22Incline/Decline in Average B-2-B selling price in past 5 years
23Competition from substitute products
24Gross margin and average profitability of suppliers
25New product development in past 12 months
26M&A in past 12 months
27Growth strategy of leading players
28Market share of vendors, 2023
29Company Profiles
30Unmet needs and opportunity for new suppliers
31Conclusion
32Appendix