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Plastics or ceramics are the typically utilized materials for IC packaging because they offer greater electrical conductivity. This aspect is crucial since IC packaging also serves the goal of enabling the installation of electrical connections that are attached to the printed circuit board (PCB) of an electronic device.
Ceramic, metal (often Kovar), or plastic (thermoset or thermoplastic) are the available materials for packaging. A common plastic used for this is epoxy-cresol-novolak (ECN). Each of the three material types has usable mechanical strength as well as heat and moisture resistance.
The Global IC(Integrated Circuit) encapsulating material market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Cooling three integrated circuits by embedding them inside an inclined cavity using nano-encapsulated phase change material. Integrated Circuits (ICs) lose a lot of efficiency when heated, and cooling ICs is one of the biggest issues facing the electronics industry. Three ICs were positioned in the midst of an inclined square enclosure to be cooled by exploiting the natural convection of water/Nano-Encapsulated Phase Change Material (NEPCM).
A PCM termed n-nonadecane, having a melting point of 30.44 °C, was used to fill the core of the NEPCM, and by introducing it to the host fluid, the heat transmission process was greatly enhanced. In the current simulation, many factors were examined on the heat transfer characteristics from the surface of the ICs, including volume % of NEPCM, Rayleigh number, and inclined angle. The inclined angle had no effect on the total heat transfer rate at Rayleigh number 102; however, at Rayleigh number 104, the inclined angle of 60 was the ideal value. Given that the injection of 3% volume fraction of NEPCM at Rayleigh number of 104 enhanced the overall heat transfer rate by 29%.
