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In chip manufacture, photolithography is a patterning procedure. A design is transferred from a photomask to a substrate during the procedure. This is typically accomplished with steppers and scanners equipped with optical light sources.
Direct-write e-beam lithography and nanoimprint are two further types of lithography. Several next-generation lithography (NGL) methods are also being researched and developed, including extreme ultraviolet (EUV), multi-beam e-beam, and guided self-assembly (DSA).
Currently, the Indian semiconductor sector is working on ISRO’s 180 nm node technology. The Semiconductor Laboratory (SCL) in Mohali employs four distinct types of photoresists that are sensitive to deep ultraviolet (DUV) light to print these nodes.
SCL is completely reliant on foreign vendors since no Indian company manufactures this DUV resists.
The INDIA PHOTOLITHOGRAPHY EQUIPMENT MARKET accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2026, registering a CAGR of XX% from 2022 to 2027.
Canon is working on lithography equipment for 3D semiconductor technologies. Canon lithography machines are planned to be released as soon as possible.
The exposure area has been increased to around four times that of previous goods, allowing for the manufacturing of huge semiconductors for AI applications.3D technology improves performance by stacking numerous semiconductor chips that are tightly coupled.
According to sources, multi-layer fine wirings that electrically link each chip are generated at a high density on the plate-shaped sections where the chips are inserted.
Canon is also working on a new sort of lithography equipment for creating such wirings. To increase exposure precision and wiring density, optical components such as lenses and stages are modified.
Ordinary lithography machines are believed to have a resolution of more than ten microns, while the new devices can handle line widths of one micron. Canon is also working on a new sort of lithography equipment for creating such wirings.
To increase exposure precision and wiring density, optical components such as lenses and stages are modified. Ordinary lithography machines are believed to have a resolution of more than ten microns, while the new devices can handle line widths of one micron.
