- Get in Touch with Us
Last Updated: Apr 25, 2025 | Study Period: 2023-2030
INTRODUCTION
InFO is a cutting-edge wafer-level system integration technology platform with high density RDL (Redistribution Layer) and TIV (Through InFO Via) for high-density interconnect and performance in a variety of applications such as mobile and high-performance computing.
A system in package, or SiP, is a method of combining two or more integrated circuits (ICs) into a single package. In contrast, a system on chip, or SoC, integrates the functions of those chips onto the same die.
SiP has existed in the form of multi-chip modules for some time. In digital circuitry, fan-out is the maximum number of digital inputs that the output of a single logic gate can feed without interfering with the operation of the circuitry.
GLOBAL INTEGRATED FAN-OUT SYSTEM-IN-PACKAGE (INFO-SIP) MARKET SIZE AND FORECAST
The Global Integrated Fan-Out System-in-Package (InFO-SIP) market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
RECENT DEVELOPMENT
Fan-Out System-in-Package (Fan-Out SiP) System-in-Package (SiP) has become a sure path for innovation and an unstoppable trend for the decade, providing every year's new generation mobile with higher performance and smaller form factor.
Through heterogeneous integration design on a laminated substrate, multi-functional active chips and related passive components are pre-assembled into a system or subsystem.
New challenges arose as SiP was introduced to mobile devices. To hit the sweet spot of consumer application, a low-cost integrated substrate became critical.
In addition to the preceding requirements, a small form factor is an important feature.As existing technology approaches its limits, innovation in the corresponding SiP package is required now and in the future.
Fan-Out redistribution layers (RDL) can be an advanced substrate to break through the constraint, so that the RDL platform will be the core technology to evolve SiP to Fan-Out SiP.
The available market approach scope is divided into smartphones, tablets, RF infrastructures, edge computing, and internet of things (IOT). Higher frequency applications, improved performance, and lower costs are driving package innovation and integration. Fan-Out SiP provides a new platform to meet market demand and enable next-generation products..
COMPANY PROFILE
THIS REPORT WILL ANSWER FOLLOWING QUESTIONS
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2023-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2023-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2023-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
© 2017-2025 Mobility Foresights Pvt Ltd. All rights reserved.