InFO is a cutting-edge wafer-level system integration technology platform with high density RDL (Redistribution Layer) and TIV (Through InFO Via) for high-density interconnect and performance in a variety of applications such as mobile and high-performance computing.
A system in package, or SiP, is a method of combining two or more integrated circuits (ICs) into a single package. In contrast, a system on chip, or SoC, integrates the functions of those chips onto the same die.
SiP has existed in the form of multi-chip modules for some time. In digital circuitry, fan-out is the maximum number of digital inputs that the output of a single logic gate can feed without interfering with the operation of the circuitry.
GLOBAL INTEGRATED FAN-OUT SYSTEM-IN-PACKAGE (INFO-SIP) MARKET SIZE AND FORECAST
The Global Integrated Fan-Out System-in-Package (InFO-SIP) market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Fan-Out System-in-Package (Fan-Out SiP) System-in-Package (SiP) has become a sure path for innovation and an unstoppable trend for the decade, providing every year’s new generation mobile with higher performance and smaller form factor.
Through heterogeneous integration design on a laminated substrate, multi-functional active chips and related passive components are pre-assembled into a system or subsystem.
New challenges arose as SiP was introduced to mobile devices. To hit the sweet spot of consumer application, a low-cost integrated substrate became critical.
In addition to the preceding requirements, a small form factor is an important feature.As existing technology approaches its limits, innovation in the corresponding SiP package is required now and in the future.
Fan-Out redistribution layers (RDL) can be an advanced substrate to break through the constraint, so that the RDL platform will be the core technology to evolve SiP to Fan-Out SiP.
The available market approach scope is divided into smartphones, tablets, RF infrastructures, edge computing, and internet of things (IOT). Higher frequency applications, improved performance, and lower costs are driving package innovation and integration. Fan-Out SiP provides a new platform to meet market demand and enable next-generation products..
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