INTERPOSER PACKAGE-ON-PACKAGE MARKET

INTRODUCTION

 An electrical interposer is a device that routes electricity from one socket or connection to another.

An  Interposer Package-on-Package is used to expand a connection across a broader pitch or divert it to another connection.

The name  Interposer Package-on-Package  is derived from the Latin verb "interfere," which means "to put between."

They are frequently utilized in high bandwidth memory, multi-chip modules, and BGA packaging.

An integrated circuit die to BGA, like the one found in the Pentium II, is a typical illustration of an  Interposer Package-on-Package .

This is accomplished using a variety of rigid and flexible substrates, most frequently FR4 for rigid substrates and polyimide for flexible substrates. Glass and silicon are also considered as integration techniques.

INTERPOSER PACKAGE-ON-PACKAGE MARKET

The Global Interposer Package-on-Package market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

INTERPOSER PACKAGE-ON-PACKAGE MARKET NEW PRODUCT LAUNCH

Amkor's well-known Interposer Package-on-Package (Interposer PoP) architecture allows precise pitch flip chip connection using either mass reflow with capillary underfill (CUF) or thermocompression with non-conductive paste (TCNCP).

The top interposer connection is made using copper core balls (CCB) and thermocompression bonding. High speed and high-density interconnect access to interposer mounted devices is made possible by the CCB connection between the bottom substrate and interposer.

This extremely reliable packaging uses epoxy mold compound to encase the die between two substrates, resulting in negligible unit warpage.

In comparison to the more constrained Through Mold Via (TMV), the top interposer offers substantially more top side attach freedom and can be linked with a wide range of devices (packaged memory, passives, die, etc.).

High-density, many I/O interconnects are possible due to the tight pitch connection between the bottom substrate and the interposer. In contrast to TMV processing,

 Interposer Package-on-Package  processing makes it possible to increase die size without increasing package body size.

Amkor has ongoing projects below 4 nm and high volume Interposer Package-on-Package experience with the most cutting-edge silicon nodes down to that size.

To far, Amkor has produced hundreds of millions of units with strong performance for a variety of clients.

Common body sizes are 0-16 mm; upon request, unique body sizes are also available. Flexible top package I/O interface for different top connections (dies, passives, etc.)Wafer handling/thinning of up to 100 m is offered.

INTERPOSER PACKAGE-ON-PACKAGE MARKET COMPANY PROFILE

• AGC Electronics
• NHanced Semiconductors, Inc. 
• Murata
• Plan Optik AG
• Xilinx
• TSMC

THIS INTERPOSER PACKAGE-ON-PACKAGE MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Interposer Package-on-Package are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Interposer Package-on-Package and key vendor selection criteria
3. Where is the Interposer Package-on-Package manufactured? What is the average margin per unit?
4. Market share of Global Interposer Package-on-Package market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Interposer Package-on-Package in-house
6. key predictions for next 5 years in Global Interposer Package-on-Package market
7. Average B-2-B Interposer Package-on-Package market price in all segments
8. Latest trends in Interposer Package-on-Package market, by every market segment
9. The market size (both volume and value) of the Interposer Package-on-Package market in 2024-2030 and every year in between?
10. Production breakup of Interposer Package-on-Package market, by suppliers and their OEM relationship