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Last Updated: Apr 26, 2025 | Study Period: 2022-2027
A field-programmable gate array (FPGA) is an integrated circuit that may be programmed or reprogrammed to the needed functionality or application after it has been manufactured.
Lower complexity, greater speed, volume designs, and programmable functionalities are all important features of field-programmable gate arrays. Field-programmable gate arrays have become a viable option for most designs and markets as technology has advanced.
A field-programmable gate array can assist computer users in customising microprocessor capabilities to match their unique demands. In reality, field-programmable gate arrays are used by engineers to create customised integrated circuits.
Alternative benefits of FPGAs include a more predictable life cycle owing to the elimination of wafer capabilities, possible respins, faster time to market compared to other solutions, and a straightforward design cycle.
Field-programmable gate arrays are employed in many industries, including aerospace, defence, data centres, automotive, medical, and wireless communications.
The Japan Field Programmable Gate Arrays (FPGA) Market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2026, registering a CAGR of XX% from 2022 to 2027.
Renesas Electronics Corporation, a leading provider of innovative semiconductor technologies, today announced the launch of a new range of extremely low-cost, very low-power Field-Programmable Gate Array (FPGA) devices.
The Forge FPGATM Family will fill a need in the market for modest quantities of programmable logic that can be developed rapidly and effectively into cost-conscious applications.
In comparison to other options, such as non-FPGA designs, the ForgeFPGA devices will save a lot of money. They lower overall board and system costs by enabling a high level of integration.
In comparison to other options, such as non-FPGA designs, the ForgeFPGA devices will save a lot of money. They lower overall board and system costs by enabling a high level of integration.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2027 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2027 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2027 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2027 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |