LAND GRID ARRAY PACKAGE ON PACKAGE (LGA PoP) MARKET 

INTRODUCTION

A land grid array package on package (LGA PoP) is a type of packaging for integrated circuits (ICs). It combines both LGA and PoP technologies to create a single package that allows for the use of multiple ICs in a single package.

The LGA PoP package is made up of two components: an LGA substrate and a PoP die. The LGA substrate contains the ICs, while the PoP die is a thin, flexible die with a substrate layer.

The PoP die is then attached to the LGA substrate using a thermocompression bonding process. This process is used to bond the two pieces together, ensuring a reliable connection between the two components.

The PoP die is flexible, allowing for the use of a range of ICs in a single package. This makes it an attractive option for applications where a variety of ICs are needed in a single device. The PoP die is also much thinner than an LGA package, allowing for a more compact package design.

The LGA PoP package is a very cost-effective solution for IC packaging. It is also very reliable and offers a high level of performance. It is a great choice for applications where multiple ICs are needed in a single package.

Overall, the LGA PoP package is a great solution for packaging ICs. It is cost-effective, reliable, and offers a high level of performance. It is a great choice for applications where multiple ICs are needed in a single package.

LAND GRID ARRAY PACKAGE ON PACKAGE (LGA PoP) MARKET SIZE AND FORECAST

The Global Land grid array package on package (LGA PoP) market  accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

LAND GRID ARRAY PACKAGE ON PACKAGE (LGA PoP) MARKET NEW PRODUCT LAUNCH

LGA PoP (Land Grid Array Package on Package) is a new type of packaging technology that offers several benefits compared to traditional packaging methods. It combines two packages into one, which reduces the overall size of the product.

LGA PoP allows for higher density, improved electrical performance, and better thermal management. This technology is becoming increasingly popular for a variety of products, including smartphones, wearables, and IoT devices. 

Several companies are launching new products that use LGA PoP technology. Qualcomm recently introduced their Snapdragon Wear 4100 and 4100+ chipsets, which use the new technology to offer an improved battery life, faster performance, and increased power efficiency.

Samsung has also embraced this technology with their Exynos 990 and Exynos 1000 chipsets. Both chipsets feature advanced LGA PoP technology, improving performance and power efficiency. 

Intel is also using LGA PoP technology in their 11th Generation Core processors, which are built on the Tiger Lake platform. This new processor offers up to 20% improvement in performance, as well as improved power efficiency and higher integration levels. 

MediaTek has also launched several products featuring LGA PoP technology, including their 5G-enabled Dimensity 1200 and 1000+ chipsets. These chipsets offer improved performance, increased power efficiency, and better thermal management. 

In addition, several Chinese companies have embraced the new technology, including Huawei, HiSilicon, and Allwinner. Allwinner’s A64 processor is based on the new LGA PoP technology, offering improved performance and power efficiency. 

Overall, LGA PoP technology is becoming increasingly popular for a variety of products, and several companies are launching products that use this technology. The benefits of this new technology include improved performance, power efficiency, and better thermal management.

LAND GRID ARRAY PACKAGE ON PACKAGE (LGA PoP) MARKET COMPANY PROFILES

• Amkor Technology 
• ASE Group 
• Chipbond Technology 
• Fujitsu Semiconductor 
• IBM Microelectronics 
• Infineon Technologies 
• Intel Corporation

THIS LAND GRID ARRAY PACKAGE ON PACKAGE (LGA PoP) MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Land grid array package on package (LGA PoP) are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Land grid array package on package (LGA PoP) and key vendor selection criteria
3. Where is the Land grid array package on package (LGA PoP) manufactured? What is the average margin per unit?
4. Market share of Global Land grid array package on package (LGA PoP) market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Land grid array package on package (LGA PoP) in-house
6. key predictions for next 5 years in Global Land grid array package on package (LGA PoP) market
7. Average B-2-B Land grid array package on package (LGA PoP) market price in all segments
8. Latest trends in Land grid array package on package (LGA PoP) market, by every market segment
9. The market size (both volume and value) of the Land grid array package on package (LGA PoP) market in 2024-2030 and every year in between?
10. Production breakup of Land grid array package on package (LGA PoP) market, by suppliers and their OEM relationship