GLOBAL LASER BONDING RIBBONS MARKET

INTRODUCTION

 In the electronics industry, particularly in the power electronics sector, a brand-new application for laser micro welding is laser ribbon bonding. Ultrasonic welding is used in traditional ribbon bonding to secure the aluminum or copper ribbon to a conductive surface.

A new ribbon bonding technology is developed by modifying an ultrasonic ribbon bonder and equipping it with a fiber laser, a galvanometric scanner, and a beam focusing and delivery system. The "laser bonder" system design and test results for welding copper ribbons with a thickness of 300 m to DCB substrates are among the presented work.

Spatial power modulation is used for the laser welding of the ribbons, and the results on the welded ribbons are shown. The work concludes with the technology's benefits and drawbacks, particularly in relation to its applications in comparison to ultrasonic bonding.

GLOBAL LASER BONDING RIBBONS MARKET  SIZE AND FORECAST

The Global Laser Bonding Ribbons market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

NEW PRODUCT LAUNCH

The F & K Delvotec Ultrasonic-Laserbonder reveals a brand-new technology. The brand-new method, which is based on laser micro-welding, is especially good for joining bonding wire to battery terminals, DCB substrates, and power electronics module copper terminals.

Ribbon bonding can be used at much higher currents thanks to ultrasonic-laser bonding. Ultrasonic-Laser bonding, which allows aluminum and copper wire to be bonded onto DCB substrates and copper terminals, not only expands the application area of bonding technology but is also more robust than conventional wire bonding. This makes electronic manufacturing simple and cost-effective.

Surface quality and cleaning procedures are less important now, and the need for completely immovable work pieces is no longer a barrier to zero-fault production.

When making batteries, this makes it possible to connect the terminals in a secure and adaptable way and eliminates the need to handle connector strips. Wire bonding's physical limit for carrying current in power electronics will eventually be reached. Laser welding, on the other hand, allows for the joining of virtually any thickness, but it is less flexible because it requires connectors that have already been manufactured.

COMPANY PROFILE

• F & K
• Laser
• Heraeus
• ametek 
• Inseto 

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Laser Bonding Ribbons are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Laser Bonding Ribbons and key vendor selection criteria
3. Where is the Laser Bonding Ribbons manufactured? What is the average margin per unit?
4. Market share of Global Laser Bonding Ribbons market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Laser Bonding Ribbons in-house
6. key predictions for next 5 years in Global Laser Bonding Ribbons market
7. Average B-2-B Laser Bonding Ribbons market price in all segments
8. Latest trends in Laser Bonding Ribbons market, by every market segment
9. The market size (both volume and value) of the Laser Bonding Ribbons market in 2024-2030 and every year in between?
10. Production breakup of Laser Bonding Ribbons market, by suppliers and their OEM relationship