GLOBAL LED ENCAPSULATION MACHINE MARKET

INTRODUCTION

 The packaging of lamp-LEDs typically uses encapsulation. The LED bracket that has undergone press welding is inserted first, followed by a liquid epoxy pour into the LED moulding chamber.

The mould is then placed in the oven, where the epoxy solidifies and the LED is moulded. When utilised to reduce light coupling losses, guide LED light at a certain viewing angle, and shield the LED chip and lead frame from certain external stresses, LED encapsulation is a technology that improves the safety of LEDs in a variety of environmental circumstances.

The exceptional reliability of high purity silicones under qualifying pressures has led to their selection for usage in LED encapsulants. In a high-pressure, high-temperature chamber where elements (gallium, arsenic, and phosphor) are purified, combined, and liquified into a concentrated solution, the semiconductor material is formed.

After being blended, a rod is inserted into the mixture and slowly drawn out.For the production of LEDs used in general lighting fixtures, mobile devices, HDTV backlighting, and other applications, materials are essential enablers.

Many high-brightness LED devices must be manufactured using silicone-based LED packaging materials.The LED chamber is filled with liquid epoxy and bracketed to the appropriate shape.

The mould is subsequently treated in our powerful ovens. The epoxy production process used by Epic Resins exceeds all standards set by the industry in terms of reliability, cost, and quality.

GLOBAL LED ENCAPSULATION MACHINE MARKET SIZE AND FORECAST

The Global LED encapsulation machine market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

LED ENCAPSULATION TECHNOLOGIES

LED chip pin-type encapsulation methods can create pins with different package forms. With established technology and a variety of options, it is the first LED product that has been successfully produced and introduced to the market.

The interior and reflective layer of the lead-type package is constantly being improved by researchers, despite the fact that it is the oldest packaging method. The potting form serves as the pin-type packed LED's packaging material.

Before inserting the pressure-welded pin-type LED bracket and placing it in the oven, the potting procedure involves injecting liquid epoxy resin into the LED cavity first.

COMPANY PROFILE

• Technophar
• Softgel
• iPhar
• Changsung
• Pharmagel

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many LED encapsulation machines are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global LED encapsulation machine and key vendor selection criteria
3. Where is the LED encapsulation machine manufactured? What is the average margin per unit?
4. Market share of Global LED encapsulation machine market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global LED encapsulation machine in-house
6. key predictions for next 5 years in Global LED encapsulation machine market
7. Average B-2-B LED encapsulation machine market price in all segments
8. Latest trends in LED encapsulation machine market, by every market segment
9. The market size (both volume and value) of the LED encapsulation machine market in 2023-2030 and every year in between?
10. Production breakup of LED encapsulation machine market, by suppliers and their OEM relationship