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Last Updated: Apr 25, 2025 | Study Period: 2023-2030
Surface-mount devices (SMDs) are placed on printed circuit boards using robotic pick-and-place machines, or P&Ps (PCB).
They are used to quickly and precisely place a variety of electronic components, such as capacitors, resistors, and integrated circuits, onto PCBs, which are then used in equipment for computers, consumer electronics, as well as industrial, medical, automotive, military, and telecommunications applications.
The same machinery is available for through-hole components.Flip chip packaging of microchips is another application for this kind of machinery.
Small electronic components and SMDs, like capacitors, resistors, and ICs, are mounted into a printed circuit board using pick and place (PnP) machines (PCB). It guarantees that the tiny components are carefully picked up and positioned on the PCB.
The machine can be semi-automated with software assisting in placement, manual and needing manual placement, or automatic for standard mass manufacturing units with in-line facilities. Here are some factors to think about before purchasing the equipment, along with their own capabilities.
The Global Linear pick & place unit market accountedfor $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Robots that pick and put items are frequently used in contemporary manufacturing settings. The process of picking up components or products and placing them in new locations is sped up by pick-and-place automation.
This procedure can be automated to boost output. Pick and place robots take care of repetitive chores, allowing human workers to concentrate on more difficult duties. Pick-and-place robots are positioned to reach various locations and are often installed on a sturdy pedestal.
They can recognise, grab, and move objects from one area to another using cutting-edge visual technologies. Pick and place robots can be built with a number of end-of-arm tooling alternatives for usage in diverse applications, such as assembling, packing, or bin picking, thanks to the availability of a variety of design options.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2023-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2023-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2023-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |