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A patterned mask, a light or electron beam, and a photoresist layer are used in lithography equipment to transfer circuit or device patterns onto a substrate. The pattern masks or reticles are aligned by overlay metrology systems.
Mask aligners, direct writing tools, wafer inspection tools, and steppers are some of the lithography tools used to produce micro-electro-mechanical systems (MEMS) and make patterns on printed circuit boards.
The global lithography tools market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Canon has just launched the FPA-3030i5a in Japan, adding it to its array of i-line stepper semiconductor lithography systems that facilitate the production of things like compound semiconductors.
The FPA-3030i5a semiconductor lithography equipment supports silicon wafers as well as compound semiconductor materials like silicon carbide (SiC) and gallium nitride (GaN).
The PROLITH virtual lithography tool’s most recent generation has been unveiled by KLA-Tencor Corporation. Researchers at cutting-edge chipmakers, consortia, and equipment manufacturers can use PROLITH X3.
1 to swiftly and affordably debug complex difficulties in EUV and double patterning lithography processes, such as line edge roughness and patterning problems related to wafer topography.
In order to increase EUV lithography’s resolution, and productivity, Lam is developing a new dry resist technology. The EUV sensitivity and resolution benefits of Lam’s dry resist solutions significantly lower the overall cost for each EUV wafer pass.
Leading-edge chipmakers are already using EUV lithography techniques in large volume manufacturing, so additional advancements in productivity and resolution will make future process nodes more amenable to cheap scaling.
The TWINSCAN XT immersion lithography system, which combines ultra-hard ultraviolet radiation with large aperture numbers, has been unveiled by ASML.
