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Last Updated: Apr 25, 2025 | Study Period: 2022-2030
A patterned mask, a light or electron beam, and a photoresist layer are used in lithography equipment to transfer circuit or device patterns onto a substrate. The pattern masks or reticles are aligned by overlay metrology systems.
Mask aligners, direct writing tools, wafer inspection tools, and steppers are some of the lithography tools used to produce micro-electro-mechanical systems (MEMS) and make patterns on printed circuit boards.
The global lithography tools market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Canon has just launched the FPA-3030i5a in Japan, adding it to its array of i-line stepper semiconductor lithography systems that facilitate the production of things like compound semiconductors.
The FPA-3030i5a semiconductor lithography equipment supports silicon wafers as well as compound semiconductor materials like silicon carbide (SiC) and gallium nitride (GaN).
The PROLITH virtual lithography tool's most recent generation has been unveiled by KLA-Tencor Corporation. Researchers at cutting-edge chipmakers, consortia, and equipment manufacturers can use PROLITH X3.
1 to swiftly and affordably debug complex difficulties in EUV and double patterning lithography processes, such as line edge roughness and patterning problems related to wafer topography.
In order to increase EUV lithography's resolution, and productivity, Lam is developing a new dry resist technology. The EUV sensitivity and resolution benefits of Lam's dry resist solutions significantly lower the overall cost for each EUV wafer pass.
Leading-edge chipmakers are already using EUV lithography techniques in large volume manufacturing, so additional advancements in productivity and resolution will make future process nodes more amenable to cheap scaling.
The TWINSCAN XT immersion lithography system, which combines ultra-hard ultraviolet radiation with large aperture numbers, has been unveiled by ASML.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |