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LQFP/TQFP is a product that is thinner than QFP, which reduces product thickness, increases board density, and improves portability.
It is appropriate for uses where height and weight are important considerations.Low profile Quad Flat Package (LQFP) is a package with a total height of less than 1.7 mm (including 1.7 mm) and more than 1.2 mm (not including 1.2 mm).
Thin profile Quad Flat packaging, or TQFP, is a packaging with a total height less than 1.2 mm.Application：Compatible with memory, portable consumer goods, radios, PC devices, automobiles, controllers, and optoelectronic components.Advantage：JEDEC Standard Package Outlines, Multi-die production capacity Full-service testingPb-free and RoHS compliant green materials are the norm Laser mark on package body 100%Sn
The Global Low-profile Quad Flat Package market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
A .Jcet Global low profile (1.4mm) version of the QFP is called a Low-profile Quad Flat Package . The Low-profile Quad Flat Package is a plastic-encapsulated, leadframe-based package with leads in the shape of gull wings on all four sides.
The Low-profile Quad Flat Package is appropriate for designs with high I/O counts while satisfying low profile requirements. It supports pin counts up to 208. They are employed in common, price-sensitive applications.
Low-profile Quad Flat Package is also available with exposed pads This Low-profile Quad Flat package has been thermally improved. An exposed die pad is used to increase thermal performance; if necessary, it can be attached to a mother PC board for efficient heat removal and grounding.
Deep downset die pad leadframe design enables this improved thermal package. Highlights include a lead pitch range of 0.80 mm to 0.40 mm and body diameters ranging from 7 x 7 mm to 28 x 28 mm.
Features-Available in gold or copper wire bond versions, with body sizes ranging from 7 x 7 mm to 28 x 28 mm, package height of 1.4 mm, lead counts ranging from 32 to 208 l, lead pitch between 0.80 mm and 0.40 mm, a variety of open tool leadframe and die pad sizes, moisture sensitivity of JEDEC Level 3, JEDEC standard compliance, and lead-free, green, and low alpha materials sets.
