GLOBAL LOW-PROFILE QUAD FLAT PACKAGE MARKET

INTRODUCTION

LQFP/TQFP is a product that is thinner than QFP, which reduces product thickness, increases board density, and improves portability.

It is appropriate for uses where height and weight are important considerations.Low profile Quad Flat Package (LQFP) is a package with a total height of less than 1.7 mm (including 1.7 mm) and more than 1.2 mm (not including 1.2 mm).

Thin profile Quad Flat packaging, or TQFP, is a packaging with a total height less than 1.2 mm.Application：Compatible with memory, portable consumer goods, radios, PC devices, automobiles, controllers, and optoelectronic components.Advantage：JEDEC Standard Package Outlines, Multi-die production capacity Full-service testingPb-free and RoHS compliant green materials are the norm Laser mark on package body 100%Sn

GLOBAL LOW-PROFILE QUAD FLAT PACKAGE MARKET SIZE AND FORECAST

The Global Low-profile Quad Flat Package market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

NEW PRODUCT LAUNCH

 A .Jcet Global low profile (1.4mm) version of the QFP is called a Low-profile Quad Flat Package . The Low-profile Quad Flat Package is a plastic-encapsulated, leadframe-based package with leads in the shape of gull wings on all four sides.

The Low-profile Quad Flat Package is appropriate for designs with high I/O counts while satisfying low profile requirements. It supports pin counts up to 208. They are employed in common, price-sensitive applications.

Low-profile Quad Flat Package is also available with exposed pads This Low-profile Quad Flat package has been thermally improved. An exposed die pad is used to increase thermal performance; if necessary, it can be attached to a mother PC board for efficient heat removal and grounding.

Deep downset die pad leadframe design enables this improved thermal package. Highlights include a lead pitch range of 0.80 mm to 0.40 mm and body diameters ranging from 7 x 7 mm to 28 x 28 mm.

Features-Available in gold or copper wire bond versions, with body sizes ranging from 7 x 7 mm to 28 x 28 mm, package height of 1.4 mm, lead counts ranging from 32 to 208 l, lead pitch between 0.80 mm and 0.40 mm, a variety of open tool leadframe and die pad sizes, moisture sensitivity of JEDEC Level 3, JEDEC standard compliance, and lead-free, green, and low alpha materials sets.

COMPANY PROFILE

• NXP
• Microchip Technology
• Amkor Technology
• Lumileds Holding B.V
• ASE Group
• Broadcom Limited

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Low-profile Quad Flat Packages are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Low-profile Quad Flat Package and key vendor selection criteria
3. Where is the Low-profile Quad Flat Package manufactured? What is the average margin per unit?
4. Market share of Global Low-profile Quad Flat Package market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Low-profile Quad Flat Package in-house
6. key predictions for next 5 years in Global Low-profile Quad Flat Package market
7. Average B-2-B Low-profile Quad Flat Package market price in all segments
8. Latest trends in Low-profile Quad Flat Package market, by every market segment
9. The market size (both volume and value) of the Low-profile Quad Flat Package market in 2023-2030 and every year in between?
10. Production breakup of Low-profile Quad Flat Package market, by suppliers and their OEM relationship