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Micro-mechanical electronic parts known as MEMS (micro-electro-mechanical systems) can be either sensors or actuators. MEMS will continue to rank among the electronic megatrends in the coming years and find use in microfluidics, autonomous driving, 5G, and artificial intelligence.
MEMS are becoming increasingly common in smartphones and wearables, including fingerprint sensors, audio and video sensors, and gravitational sensors. On wafers, which can be made of silicon, glass, compound semiconductors, epoxy, and a variety of metals, MEMS are manufactured.
Silicon devices can now contain devices like pressure sensors, microphones, gyroscopes, and accelerometers thanks to microelectromechanical systems (MEMS).
MEMS technology structures depend on the integrity of the hermetic bond to prevent contamination and guarantee dependable operation because they are so small and sensitive. Clear imaging of each crucial bond ring on every device is necessary for nondestructive testing (NDT) for MEMS applications in a production environment.
Regardless of the materials employed, the Confits WAFER inspect AOI and metrology tools capture these surfaces in 3D and 2D, enabling them to be used for thorough measurement jobs in the MEMS inspection and MEMS metrology fields.
The Global MEMS inspection system market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The dependability of MEMS is higher than that of discretely placed sensors and actuators. The absence of connectors, lines, and cables and the utilization of basic physical effects that provide quick responses and practical methods can both be used to explain this.
Structures must be inspected to find flaws using automated optical inspection, and the MEMS must be measured appropriately using 2D or 3D MEMS metrology in order to govern and control production processes.
Contrary to chromatic confocal sensors and white light interferometers, which have challenges in this area, Confits AOI and metrology instruments may execute their 3D measurement regardless of the substance in question. As a result, it is also feasible to detect material combinations, such as gold and epoxy, chromium on glass.
Additionally, the inspection head’s special features include objective lenses with three distinct resolutions. During operation, the lenses are automatically altered to their ideal focus, allowing this single device to carry out a wide range of inspections including both micro and macro problems.
The entire wafer surface is scanned using a line sensor, much like in earlier models, making it possible to conduct inspections at a constant speed regardless of chip size or quantity. With such a wide range of features, output is extremely consistent while yield rates are increased.
