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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
The most prevalent method of interconnecting microwave and RF MCMs is ribbon bonding. Ribbons made of precious and nonprecious metals have low apparent resistance (impedance) and good heat dissipation. offers ribbons and bonding wires made of gold (Au), silver (Ag), copper (Cu), and aluminum (Al).
These ribbons and bonding wires come in ultra-fine wires (10 to 38 m) and thick wires (100 to 500um) for power devices. Wires with clean, smooth surfaces and excellent dimensional stability are provided along with metal bond expertise-based solutions.
The semiconductor industry is still supported by high-performance gold (Au) and gold alloy bonding wires. They distinguish themselves from other metals by their superior electrical conductivity and chemical stability. It is possible to achieve functions like low loop and fine pitch while maintaining high purity through material development.
The Global Metal Bonding Ribbons market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Metal bonding wire is COINING's area of expertise. They know how to draw our wire into the smallest possible sizes with the highest tensile strength and the tightest tolerances. We deliver homogeneous high-purity wire with extremely clean surfaces and a smooth finish thanks to their in-house drawing, rolling, annealing, and analytical capabilities.
Gold, Aluminum, and Solder are just a few of the high-performance bonding wires they supply. Additionally, COINING offers bonding ribbon, which enables extremely reliable bonding with fewer bonds.
Their gold and aluminum bonding ribbons are extremely strong and resistant to corrosion. When compared to wire, ribbon provides superior electrical properties like improved heat dissipation and increased throughput.
Coining, a subsidiary of Ametek, is a world-class manufacturer of gold, aluminum, and copper high-purity bonding wire and ribbon. As the electrical link between a chip and a substrate, two chips, or two substrates, these are frequently used in the production of semiconductor and microelectronic devices.
In the electronics industry, particularly in the power electronics sector, a brand-new application for laser micro welding is laser ribbon bonding. Ultrasonic welding is used in traditional ribbon bonding to secure the aluminum or copper ribbon to a conductive surface.
A new ribbon bonding technology is developed by modifying an ultrasonic ribbon bonder and equipping it with a fiber laser, a galvanometric scanner, and a beam focusing and delivery system.
The "laser bonder" system design and test results for welding copper ribbons with a thickness of 300 m to DCB substrates are among the presented work. Spatial power modulation is used for the laser welding of the ribbons, and the results on the welded ribbons are shown. The work concludes with the technology's benefits and drawbacks, particularly in relation to its applications in comparison to ultrasonic bonding.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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