GLOBAL METAL HARD MASK MARKET

INTRODUCTION

 In semiconductor fabrication, a hard mask is used as an etch mask in place of a polymer or other organic "soft" resist material.

When the substance being etched is an organic polymer, hard masks are required. Since the photoresist being used to define its patterning is likewise an organic polymer, anything used to etch this material will also etch the photoresist.

This occurs, for instance, when low-dielectric insulating layers used in VLSI production are patterned. Oxygen, fluorine, chlorine, and other reactive gases employed in plasma etching have a tendency to easily etch polymers.

Using a hard mask necessitates an additional deposition procedure, which raises the cost. First, a typical photoresist method is used to deposit and etch the hard mask material into the desired design.

The underlying material can then be etched through the hard mask after that. Finally, a second etching procedure is used to remove the hard mask. Metal or dielectric can be used as hard mask materials.

Low-dielectric materials are often etched using silicon-based masks made of silicon dioxide or silicon carbide.

However, an etchant that destroys silicon compounds is necessary for SiOCH (carbon doped hydrogenated silicon oxide), a material used to insulate copper interconnects.

Hard masks made of metal or amorphous carbon are utilised with this material. Tantalum nitride has also been utilised, but titanium nitride is the material most frequently used for hardmasks.

GLOBAL METAL HARD MASK MARKET SIZE AND FORECAST

The Global metal hard mask market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.

MARKET DYNAMICS

For BEOL patterning, the TiN Hard Mask (TiN-HM) integration approach has been widely used to prevent ultra low-k (ULK) damage during the plasma-ash process .

New integration strategies must be adopted as the technology node develops to pattern features with a pitch of less than 80 nm using 193 nm immersion lithography.

To achieve Self-Aligned-Via (SAV) integration, which fixes the via-metal short yield and TDDB problems brought on by Litho-Etch-Litho-Etch (LELE) misalignment, thicker TiN-HM is specifically required .

The high aspect ratio of the structures makes the Cu filling procedure considerably more challenging if the thick TiN is not removed.

 Additionally, the use of a TiN hard mask may result in the formation of a time-dependent crystal growth (TiCOF) residue between line etching and metal deposition  which further impedes copper filling.

One solution to the issue is post-etch treatment after line etching, but N2 plasma is not effective enough to completely suppress the residue , and the CH4 treatment suggested in  may be challenging to implement for 14 nm node.

Therefore, an effective wet strip and clean provides a better solution.

COMPANY PROFILE

• Electronic Materials USA Corp
• JSR
• Merck Group
• Nissan Chemical Industries
• Samsung SDI

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. What is the average cost perGlobal metal hard mask marketright now and how will it change in the next 5-6 years?
2. Average cost to set up aGlobal metal hard mask marketin the US, Europe and China?
3. How manyGlobal metal hard mask marketare manufactured per annum globally? Who are the sub-component suppliers in different regions?
4. What is happening in the overall public, globally?
5. Cost breakup of aGlobal metal hard mask marketand key vendor selection criteria
6. Where is theGlobal metal hard mask market manufactured? What is the average margin per equipment?
7. Market share ofGlobal metal hard mask marketmanufacturers and their upcoming products
8. The most important plannedGlobal metal hard mask marketin next 2 years
9. Details on network of majorGlobal metal hard mask marketand pricing plans
10. Cost advantage for OEMs who manufactureGlobal metal hard mask marketin-house
11. 5 key predictions for next 5 years inGlobal metal hard mask market
12. Average B-2-BGlobal metal hard mask marketprice in all segments
13. Latest trends inGlobal metal hard mask market, by every market segment
14. The market size (both volume and value) ofGlobal metal hard mask marketin 2022-2030 and every year in between?
15. Global production breakup ofGlobal metal hard mask market, by suppliers and their OEM relationship