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A form of integrated circuit (IC) package used for surface mount applications is the Metric Quad Flat Package (MQFP). The term “quad flat” refers to a square or rectangular box with leads protruding from all four corners. The “metric” prefix indicates that the package dimensions are calculated using metric units.
A variety of ICs, including as microcontrollers, digital signal processors, and other sophisticated integrated circuits, are frequently employed in MQFP packaging. High-density designs are made possible by the package’s small and effective way of attaching the IC onto a printed circuit board (PCB).
MQFP packages have a number of benefits, including effective PCB area utilisation, effective heat dissipation, and compatibility for automated assembly procedures. The package is made to be directly attached to the PCB, which streamlines production and lowers costs.
It’s crucial to use the right handling and soldering procedures when working with MQFP packages to ensure dependable connections and avoid IC damage. This usually entails employing the necessary soldering tools, procedures, and ESD (electrostatic discharge) protection.
The Global Metric Quad Flat Package Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The Metric Quad Flat Pack (MQFP) is a plastic-encapsulated, leadframe-based packaging with leads in the shape of gull wings on all four sides. The MQFP is designed to provide excellent levels of thermal and electrical performance while being targeted at applications with limited budgets.
The MQFP gives designers the flexibility and ease to suit their packaging demands for a wide variety of device designs since it is available in a wide range of body sizes and pin counts.
A thermally improved variant of the MQFP packaging is called the Heat Spreader Metric Quad Flat Pack (MQFP-d) from JCET. An integrated anodized aluminium heat spreader is dropped in during the mold-making process to provide thermal improvement.
This procedure provides an additional thermal performance buffer for high power applications while still enabling the use of a conventional leadframe. The thermal performance of the MQFP-d package is typically 30% better than that of the normal MQFP packages.
