METRIC QUAD FLAT PACKAGE MARKET

INTRODUCTION

 A form of integrated circuit (IC) package used for surface mount applications is the Metric Quad Flat Package (MQFP). The term "quad flat" refers to a square or rectangular box with leads protruding from all four corners. The "metric" prefix indicates that the package dimensions are calculated using metric units.

A variety of ICs, including as microcontrollers, digital signal processors, and other sophisticated integrated circuits, are frequently employed in MQFP packaging. High-density designs are made possible by the package's small and effective way of attaching the IC onto a printed circuit board (PCB).

MQFP packages have a number of benefits, including effective PCB area utilisation, effective heat dissipation, and compatibility for automated assembly procedures. The package is made to be directly attached to the PCB, which streamlines production and lowers costs.

It's crucial to use the right handling and soldering procedures when working with MQFP packages to ensure dependable connections and avoid IC damage. This usually entails employing the necessary soldering tools, procedures, and ESD (electrostatic discharge) protection.

METRIC QUAD FLAT PACKAGE MARKETSIZE AND FORECAST

 TheGlobal Metric Quad Flat Package Marketaccounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

METRIC QUAD FLAT PACKAGE MARKET NEW PRODUCT LAUNCH

The Metric Quad Flat Pack (MQFP) is a plastic-encapsulated, leadframe-based packaging with leads in the shape of gull wings on all four sides. The MQFP is designed to provide excellent levels of thermal and electrical performance while being targeted at applications with limited budgets.

The MQFP gives designers the flexibility and ease to suit their packaging demands for a wide variety of device designs since it is available in a wide range of body sizes and pin counts.

A thermally improved variant of the MQFP packaging is called the Heat Spreader Metric Quad Flat Pack (MQFP-d) from JCET. An integrated anodized aluminium heat spreader is dropped in during the mold-making process to provide thermal improvement.

This procedure provides an additional thermal performance buffer for high power applications while still enabling the use of a conventional leadframe. The thermal performance of the MQFP-d package is typically 30% better than that of the normal MQFP packages.

METRIC QUAD FLAT PACKAGE MARKET COMPANY PROFILES

• Amkor technology
• MadPCB
• FS PCBA 
• Skyquest Technology 
• JCET

THIS METRIC QUAD FLAT PACKAGE MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Metric Quad Flat Packages are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Metric Quad Flat Package and key vendor selection criteria
3. Where is the Metric Quad Flat Package manufactured? What is the average margin per unit?
4. Market share of Global Metric Quad Flat Package market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Metric Quad Flat Package  in-house
6. key predictions for next 5 years in Global Metric Quad Flat Package market
7. Average B-2-B Metric Quad Flat Package market price in all segments
8. Latest trends in Metric Quad Flat Package market, by every market segment
9. The market size (both volume and value) of the Metric Quad Flat Package market in 2024-2030 and every year in between?
10. Production breakup of Metric Quad Flat Package market, by suppliers and their OEM relationship