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Last Updated: Apr 25, 2025 | Study Period:
A surface mount integrated circuit (IC) package known as the Mini Small Outline Package (MSOP) provides a small and efficient way to mount ICs on printed circuit boards (PCBs). The MSOP package's total footprint is intended to be as small as possible while yet offering dependable electrical connections.
The MSOP package is appropriate for applications with limited space because to its tiny size and low profile. It has a square or rectangular body with leads extending from two opposing edges, making surface installation onto the PCB simple.
The "mini" in MSOP denotes its diminutive size in comparison to other common package types. The lead pitch (spacing) of the MSOP package is commonly 0.5mm or 0.65mm, allowing for high-density installation and effective utilisation.
The Small Outline Integrated Circuit Packaging Format for Integrated Circuits has been downsized into the Mini Small Outline Package (MSOP).PCB.
To maintain trustworthy connections and prevent IC damage while dealing with MSOP packages, suitable handling and soldering procedures must be used. To facilitate the effective deployment of MSOP packages, manufacturers often give specifications and suggestions for PCB layout, soldering temperatures, and other factors.
The Global Mini Small Outline Package (Msop) Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Amkor's TSSOP & MSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1 mm mounted height.
Leadframe-based, plastic-encapsulated Amkor TSSOP & MSOP packages are ideally suited for applications needing less than 1 mm of mounting height since they are leadframe-based.
For applications needing less than 1 mm of installed height, the TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe-based, plastic-encapsulated packages. These widely used packages offer a value-added, affordable solution for a variety of applications and operate in extremely large volumes.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introdauction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in theIndustry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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