Global Multimedia SoC Market 2024-2030
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Global Multimedia SoC Market 2024-2030

Last Updated:  Apr 25, 2025 | Study Period: 2024-2030

MULTIMEDIA SoC MARKET

 

INTRODUCTION TOMULTIMEDIA SoC MARKET

The multimedia system-on-a-chip consists of a potent processor, a SIMD coprocessor, SRAM memory, and a number of interfaces, and it has all the parts required to execute modern multimedia programs.

 

The popularity of mobile multimedia is surging quickly. Rich multimedia and communications capabilities on mobile devices are on the rise as a result of this. End customers in the portable wireless market sector want mobile versions of the same multimedia and communication experiences they have at home.

 

A few of the important applications paving the way for greater performance multimedia are video playback, multiplayer gaming, and video conferencing. These multimedia applications are being fed by the increased availability of incoming multimedia data via wireless networks, camera sensors, and audio capture.

 

The development of the smart home is being driven by multimedia processors. Synaptics' solutions allow an engaging and immersive multimedia experience with seamless connectivity for next-generation AI-based smart home devices by using our well-established expertise in high-performance, power-efficient semiconductor designs.

 

CPUs with up to 40K DMIPS, gaming-grade GPUs, speech, and Neural Network processing units are all included in the VideoSmart series SoCs. These potent systems incorporate a CPU, NPU, and GPU into a single SoC with enhanced software capabilities. They enable a variety of smart multimedia devices, such as set-top boxes, OTT streaming devices, soundbars, cameras, and intelligent displays.

 

MULTIMEDIA SoC MARKET SIZE AND FORECAST

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The Global Multimedia SoC market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

 

MULTIMEDIA SoC MARKETNEW PRODUCT LAUNCH

MediaTek Technology launched Multimedia SoC, Diaries virtual session gave us a sneak peek at the upcoming crop of smartphone chips. The flagship System-on-Chip (SoC), Dimensity 1200, of Taiwanese semiconductor manufacturer MediaTek has been introduced to the Indian market.

 

Realme will be the first smartphone company to use the MediaTek Dimensity 1200 processor, and it will shortly introduce its line of 5G phones to India. Gamers and users of mobile applications like streaming media, photography, videography, and picture editing are anxiously anticipating the rich and immersive 5G experiences that the new devices powered by Dimensity 1200 will bring.

 

The almost 2 billion linked devices that MediaTek, a multinational fabless semiconductor manufacturer, makes possible each year. It creates cutting-edge systems-on-chip (SoC) for goods related to networking, IoT, home entertainment, and mobile devices. 

 

MULTIMEDIA SoC MARKETRECENT DEVELOPMENT AND INNOVATION

 

S NoProduct NameDevelopment
1T7520UNISOC, a well-known producer of IoT and mobile communication chipsets, unveiled the UNISOC T7520, a new 5G SoC mobile platform. 
2MC9S08SUx microcontrollerThe MC9S08SUx microcontroller (MCU) family from NXP Semiconductors N.V. is the world's smallest single-chip SoC solution and provides ultra-high-voltage solutions for drones, robots, power tools, healthcare, and other low-end brushless DC electric motor control (BLDC) applications.
3STMP3600SigmaTel releases a software development kit (SDK) for its fourth-generation system-on-chip (SoC) portable multimedia player solution, the STMP3600. 

SigmaTel is a mixed-signal multimedia IC vendor.

The kit, SDK 4.201, offers users a more stable software development environment with support for Windows Media DRM10 and Microsoft PlaysForSure.

 

 

T7520delivers an optimized 5G experience with significantly improved AI computing and multimedia imaging processing capabilities while reducing power consumption thanks to cutting-edge process technology.

 

The second-generation 5G smartphone platform from UNISOC is called T7520. Built using the most up-to-date design methodologies and EUV manufacturing technology, it provides significantly improved performance at the lowest level of power consumption ever.

 

With four Arm Cortex-A76 cores, four Arm Cortex-A55 cores, and a GPU built on the Arm Mali-G57 architecture, the T7520 offers amazing streaming and gaming performance at 5G speeds.

 

The T7520, built on UNISOC's Makalu 5G platform, incorporates the first 5G modem in the world to offer coverage improvement for any application scenario .

 

T7520 broadens the use of UNISOC's patented large-bandwidth dynamic spectrum sharing technology by enabling carriers to roll out 5G on their current 4G spectrums. 

 

This encourages collaboration and sharing for a quicker and less expensive rollout of 5G.

 

The sturdy 8-bitMC9S08SUxmicrocontroller family, which is an extension of the company's S08 series of MCUs, offers a wide range of supply voltage with a cheaper bill of materials (BOM) cost and tighter integration for improved performance and reliability. 

 

The new SoC units respond to the rising desire to replace several device solutions with a single MCU in order to lower cost and system size while streamlining integration and layout for use cases requiring limited floor space.

 

The MC9S08SUx provides an all-in-one solution for motor control applications by utilizing the upgraded S08L central processing unit with three-phase MOSFET pre-drivers. 

 

For a simple, affordable solution, the single-chip MC9S08SUx MCU eliminates the requirement for Low Drop Out (LDO) voltage regulator(s), operational amplifiers, and pre-drivers. 

 

Additionally, nearly all of the features required for BLDC motor control, such as zero crossing point detection, pulse width measurement, over voltage protection, and over current protection, have been integrated by NXP, making it simple for programmers to set up registers and use the features in applications. 

 

A current measuring amplifier is also part of the MC9S08SUx family, which also supports three high-side PMOSes and three low-side NMOSes. 

 

TheSTMP3600offers the highest level of performance and most integration of any product on the market, and the new SDK 4.201 gives designers the resources they need to create products with more functionality.

 

The SDK 4.201, according to SigmaTel, also has the capacity to save and playback Windows Media DRM10 content from removable media, audio playback with concurrent JPEG decoding for slideshows and wallpaper, support for the Standard interface to add product differentiating features, and WMA encode capability. According to SigmaTel, the kit also provides the lowest power usage in the market.

 

 

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

  1. How many Multimedia SoC are manufactured per annum globally? Who are the sub-component suppliers in different regions?
  2. Cost breakup of a Global Multimedia SoC and key vendor selection criteria
  3. Where is the Multimedia SoC manufactured? What is the average margin per unit?
  4. Market share of Global Multimedia SoC market manufacturers and their upcoming products
  5. Cost advantage for OEMs who manufacture Global Multimedia SoC in-house
  6. key predictions for next 5 years in Global Multimedia SoC market
  7. Average B-2-B Multimedia SoC market price in all segments
  8. Latest trends in Multimedia SoC market, by every market segment
  9. The market size (both volume and value) of the Multimedia SoC market in 2024-2030 and every year in between?
  10. Production breakup of Multimedia SoC market, by suppliers and their OEM relationship

 

Sl noTopic
1Market Segmentation
2Scope of the report
3Abbreviations
4Research Methodology
5Executive Summary
6Introduction
7Insights from Industry stakeholders
8Cost breakdown of Product by sub-components and average profit margin
9Disruptive innovation in the Industry
10Technology trends in the Industry
11Consumer trends in the industry
12Recent Production Milestones
13Component Manufacturing in US, EU and China
14COVID-19 impact on overall market
15COVID-19 impact on Production of components
16COVID-19 impact on Point of sale
17Market Segmentation, Dynamics and Forecast by Geography, 2024-2030
18Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030
19Market Segmentation, Dynamics and Forecast by Application, 2024-2030
20Market Segmentation, Dynamics and Forecast by End use, 2024-2030
21Product installation rate by OEM, 2023
22Incline/Decline in Average B-2-B selling price in past 5 years
23Competition from substitute products
24Gross margin and average profitability of suppliers
25New product development in past 12 months
26M&A in past 12 months
27Growth strategy of leading players
28Market share of vendors, 2023
29Company Profiles
30Unmet needs and opportunity for new suppliers
31Conclusion
32Appendix