Global Multimedia SoC Market 2024-2030

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    The multimedia system-on-a-chip consists of a potent processor, a SIMD coprocessor, SRAM memory, and a number of interfaces, and it has all the parts required to execute modern multimedia programs.


    The popularity of mobile multimedia is surging quickly. Rich multimedia and communications capabilities on mobile devices are on the rise as a result of this. End customers in the portable wireless market sector want mobile versions of the same multimedia and communication experiences they have at home.


    A few of the important applications paving the way for greater performance multimedia are video playback, multiplayer gaming, and video conferencing. These multimedia applications are being fed by the increased availability of incoming multimedia data via wireless networks, camera sensors, and audio capture.


    The development of the smart home is being driven by multimedia processors. Synaptics’ solutions allow an engaging and immersive multimedia experience with seamless connectivity for next-generation AI-based smart home devices by using our well-established expertise in high-performance, power-efficient semiconductor designs.


    CPUs with up to 40K DMIPS, gaming-grade GPUs, speech, and Neural Network processing units are all included in the VideoSmart series SoCs. These potent systems incorporate a CPU, NPU, and GPU into a single SoC with enhanced software capabilities. They enable a variety of smart multimedia devices, such as set-top boxes, OTT streaming devices, soundbars, cameras, and intelligent displays.



    infographic: Multimedia SoC Market, Multimedia SoC Market Size, Multimedia SoC Market Trends, Multimedia SoC Market Forecast, Multimedia SoC Market Risks, Multimedia SoC Market Report, Multimedia SoC Market Share

    The Global Multimedia SoC market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.



    MediaTek Technology launched Multimedia SoC, Diaries virtual session gave us a sneak peek at the upcoming crop of smartphone chips. The flagship System-on-Chip (SoC), Dimensity 1200, of Taiwanese semiconductor manufacturer MediaTek has been introduced to the Indian market.


    Realme will be the first smartphone company to use the MediaTek Dimensity 1200 processor, and it will shortly introduce its line of 5G phones to India. Gamers and users of mobile applications like streaming media, photography, videography, and picture editing are anxiously anticipating the rich and immersive 5G experiences that the new devices powered by Dimensity 1200 will bring.


    The almost 2 billion linked devices that MediaTek, a multinational fabless semiconductor manufacturer, makes possible each year. It creates cutting-edge systems-on-chip (SoC) for goods related to networking, IoT, home entertainment, and mobile devices. 




    S No Product Name Development
    1 T7520 UNISOC, a well-known producer of IoT and mobile communication chipsets, unveiled the UNISOC T7520, a new 5G SoC mobile platform. 
    2 MC9S08SUx microcontroller The MC9S08SUx microcontroller (MCU) family from NXP Semiconductors N.V. is the world’s smallest single-chip SoC solution and provides ultra-high-voltage solutions for drones, robots, power tools, healthcare, and other low-end brushless DC electric motor control (BLDC) applications.
    3 STMP3600 SigmaTel releases a software development kit (SDK) for its fourth-generation system-on-chip (SoC) portable multimedia player solution, the STMP3600. 

    SigmaTel is a mixed-signal multimedia IC vendor.

    The kit, SDK 4.201, offers users a more stable software development environment with support for Windows Media DRM10 and Microsoft PlaysForSure.



    T7520 delivers an optimized 5G experience with significantly improved AI computing and multimedia imaging processing capabilities while reducing power consumption thanks to cutting-edge process technology.


    The second-generation 5G smartphone platform from UNISOC is called T7520. Built using the most up-to-date design methodologies and EUV manufacturing technology, it provides significantly improved performance at the lowest level of power consumption ever.


    With four Arm Cortex-A76 cores, four Arm Cortex-A55 cores, and a GPU built on the Arm Mali-G57 architecture, the T7520 offers amazing streaming and gaming performance at 5G speeds.


    The T7520, built on UNISOC’s Makalu 5G platform, incorporates the first 5G modem in the world to offer coverage improvement for any application scenario .


    T7520 broadens the use of UNISOC’s patented large-bandwidth dynamic spectrum sharing technology by enabling carriers to roll out 5G on their current 4G spectrums. 


    This encourages collaboration and sharing for a quicker and less expensive rollout of 5G.


    The sturdy 8-bit MC9S08SUx microcontroller family, which is an extension of the company’s S08 series of MCUs, offers a wide range of supply voltage with a cheaper bill of materials (BOM) cost and tighter integration for improved performance and reliability. 


    The new SoC units respond to the rising desire to replace several device solutions with a single MCU in order to lower cost and system size while streamlining integration and layout for use cases requiring limited floor space.


    The MC9S08SUx provides an all-in-one solution for motor control applications by utilizing the upgraded S08L central processing unit with three-phase MOSFET pre-drivers. 


    For a simple, affordable solution, the single-chip MC9S08SUx MCU eliminates the requirement for Low Drop Out (LDO) voltage regulator(s), operational amplifiers, and pre-drivers. 


    Additionally, nearly all of the features required for BLDC motor control, such as zero crossing point detection, pulse width measurement, over voltage protection, and over current protection, have been integrated by NXP, making it simple for programmers to set up registers and use the features in applications. 


    A current measuring amplifier is also part of the MC9S08SUx family, which also supports three high-side PMOSes and three low-side NMOSes. 


    The STMP3600 offers the highest level of performance and most integration of any product on the market, and the new SDK 4.201 gives designers the resources they need to create products with more functionality.


    The SDK 4.201, according to SigmaTel, also has the capacity to save and playback Windows Media DRM10 content from removable media, audio playback with concurrent JPEG decoding for slideshows and wallpaper, support for the Standard interface to add product differentiating features, and WMA encode capability. According to SigmaTel, the kit also provides the lowest power usage in the market.




    1. How many Multimedia SoC are manufactured per annum globally? Who are the sub-component suppliers in different regions?
    2. Cost breakup of a Global Multimedia SoC and key vendor selection criteria
    3. Where is the Multimedia SoC manufactured? What is the average margin per unit?
    4. Market share of Global Multimedia SoC market manufacturers and their upcoming products
    5. Cost advantage for OEMs who manufacture Global Multimedia SoC in-house
    6. key predictions for next 5 years in Global Multimedia SoC market
    7. Average B-2-B Multimedia SoC market price in all segments
    8. Latest trends in Multimedia SoC market, by every market segment
    9. The market size (both volume and value) of the Multimedia SoC market in 2024-2030 and every year in between?
    10. Production breakup of Multimedia SoC market, by suppliers and their OEM relationship


    Sl no Topic
    1 Market Segmentation
    2 Scope of the report
    3 Abbreviations
    4 Research Methodology
    5 Executive Summary
    6 Introduction
    7 Insights from Industry stakeholders
    8 Cost breakdown of Product by sub-components and average profit margin
    9 Disruptive innovation in the Industry
    10 Technology trends in the Industry
    11 Consumer trends in the industry
    12 Recent Production Milestones
    13 Component Manufacturing in US, EU and China
    14 COVID-19 impact on overall market
    15 COVID-19 impact on Production of components
    16 COVID-19 impact on Point of sale
    17 Market Segmentation, Dynamics and Forecast by Geography, 2024-2030
    18 Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030
    19 Market Segmentation, Dynamics and Forecast by Application, 2024-2030
    20 Market Segmentation, Dynamics and Forecast by End use, 2024-2030
    21 Product installation rate by OEM, 2023
    22 Incline/Decline in Average B-2-B selling price in past 5 years
    23 Competition from substitute products
    24 Gross margin and average profitability of suppliers
    25 New product development in past 12 months
    26 M&A in past 12 months
    27 Growth strategy of leading players
    28 Market share of vendors, 2023
    29 Company Profiles
    30 Unmet needs and opportunity for new suppliers
    31 Conclusion
    32 Appendix
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