NON-CONDUCTIVE DIE ATTACH FILM MARKET

INTRODUCTION

Wide-ranging wirebond packaging flexibility is provided by non-conductive die attach film for very reliable applications. A high-performance non-conductive die attach film (ncDAF) developed to meet the demands of modern packaging device designs has been made commercially available.

With excellent adhesion to a wide variety of substrates (FR4, gold-plated alumina, LCP, PETP, etc.) and an extended working life,non-conductive die attach adhesives meet an extensive range of customer requirements and specifications.

The adhesives are used in widely differing die bonding applications, including semiconductor assembly onto leadframes, microelectronic hybrid assembly onto alumina, commercial FR4 applications, etc.

In as little as one second, the visible fillet of adhesive surrounding the die can be light-fixed, ensuring that the die is stationary between placement and curing. It is necessary to heat cure materials, which can be done in as short as 10 minutes at 100°C or 30 minutes at 80°C.

NON-CONDUCTIVE DIE ATTACH FILM MARKET SIZE AND FORECAST

Global Non-conductive Die Attach Film market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

NEW PRODUCT LAUNCH

Henkel announced the launch of a high-performance non-conductive die attach film (ncDAF) today. This product was developed to meet the needs of modern packaging device designs.

A high-reliability ncDAF with outstanding workability and processability, Loctite Ablestik ATB 125GR is compatible with small- to medium-sized die and appropriate for wirebond laminate and lead frame packaging.

Smaller, thinner, high-density package structures are the norm as 3D packaging downsizing spreads throughout the microelectronics industry.

Due to these factors, many packaging professionals choose die attach film materials over pastes to enable more difficult dimensions.

Die attach films provide consistent fillet development, controlled thickness and flow, no resin bleed, and bond line integrity both before and after cure in comparison to pastes.

Due to its high reliability and Automotive Grade 0 performance for both laminate and lead frame designs, Loctite Ablestik ATB 125GR is a good choice for demanding applications in the consumer, automotive, and industrial sectors.

This gap has been filled by Loctite Ablestik ATB 125GR, which also provides remarkable reliability by being able to withstand a rigorous 1,000 cycles of temperature testing (-60°C to 150°C).

COMPANY PROFILE

• Henkel Adhesives
• Inseto
• AI Technology, Inc.
• NITTO DENKO
• Grand Win

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Non-conductive Die Attach Film are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Non-conductive Die Attach Film and key vendor selection criteria
3. Where is the Non-conductive Die Attach Film manufactured? What is the average margin per unit?
4. Market share of Global Non-conductive Die Attach Film market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Non-conductive Die Attach Film in-house
6. key predictions for next 5 years in Global Non-conductive Die Attach Film market
7. Average B-2-B Non-conductive Die Attach Film market price in all segments
8. Latest trends in Non-conductive Die Attach Film market, by every market segment
9. The market size (both volume and value) of the Non-conductive Die Attach Film market in 2024-2030 and every year in between?
10. Production breakup of Non-conductive Die Attach Film market, by suppliers and their OEM relationship