GLOBAL NOR-BASED MULTI-CHIP PACKAGE MARKET

INTRODUCTION

A NOR-Based multichip package type memory system is disclosed. It consists of a variety of memory integrated circuit types that are housed in a package with an internal bus and accessible from the outside and/or inside the package, as well as a controlling integrated circuit that is housed in the package and controls an internal bus when it receives instructions for data transfer from the outside of the package.

The installation of memory integrated circuits (storer LSI) that are connected to computer systems and I/O often occurs under the direction of the system’s central processor unit.

However, if the CPU handles data transmission and reception via system bus as part of the overall management of system bus, the strain placed on the CPU will grow.

By convention, employ DMA pattern to efficiently execute storer LSI, possibly communicate data between storer LSI and the input/output device, and lessen CPU burden.

Being positioned at from polytype memory integrated circuit is read out up to the data of the memory cell of the continuation address of the termination address of this first instruction, and being at the control integrated circuit in the accumulator system that is encapsulated in the encapsulation when instruction that data in package outside is received accumulator system transmit.

GLOBAL NOR-BASED MULTI-CHIP PACKAGE MARKET SIZE AND FORECAST

 The Global NOR-Based Multi-Chip Package market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

NEW PRODUCT LAUNCH

The first multi-chip package featuring PRAM in the industry was launched by Samsung Electronics and will be used in smartphones starting later this quarter.

The 512 MB Samsung PRAM in the MCP is backwards compatible with NOR flash memory in the 40 nanometer class in terms of both hardware and software capability, giving mobile phone manufacturers the convenience of multi-chip packaging that is completely compatible with previous stand-alone PRAM chip technology.

As NOR flash’s replacement in consumer electronics designs, PRAM is anticipated to be widely adopted and develop into a significant memory technology.

PRAM offers three times the data storage performance per word of NOR chips because it stores data using the phase-change properties of its base material, an alloy of germanium, antimony, and titanium.The nonvolatile properties of flash memory and the high-speed capabilities of DRAM are combined in this new PRAM-packaged memory.

COMPANY PROFILE

• Samsung
• Cypress Semiconductor
• Microchip Technology
• Winbond
• ISSI 

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many NOR-Based Multi-Chip Package are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global NOR-Based Multi-Chip Package and key vendor selection criteria
3. Where is the NOR-Based Multi-Chip Package manufactured? What is the average margin per unit?
4. Market share of Global NOR-Based Multi-Chip Package market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global NOR-Based Multi-Chip Package in-house
6. key predictions for next 5 years in Global NOR-Based Multi-Chip Package market
7. Average B-2-B NOR-Based Multi-Chip Package market price in all segments
8. Latest trends in NOR-Based Multi-Chip Package market, by every market segment
9. The market size (both volume and value) of the NOR-Based Multi-Chip Package market in 2023-2030 and every year in between?
10. Production breakup of NOR-Based Multi-Chip Package market, by suppliers and their OEM relationship