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Peak performance of the enhanced data center accelerators is orders of magnitude better than traditional computing systems.
The North America Data Center Accelerator Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The Alveo U55C, a new data-center accelerator from Xilinx, has been released. The FPGA-powered Alveo U55C is mostly comparable to its predecessor, the Alveo U280. The U280, on the other hand, has 8GB of HBM2 memory and 16GB of DDR4 DRAM, whilst the U55C has 16GB of HBM2 memory but no DDR4 DRAM.
HBM2 memory is both quicker and more expensive than DDR4. Xilinx is able to boost performance while reducing power and size by switching to HBM2 and deleting DDR4. Compared to the full height, full length, dual width form factor of the U280, the Alveo U55C is a single-slot full height, half length (FHHL) form factor.
Over the next four years, Intel will produce three generations of infrastructure processing units: 200 GB, 400 GB, and 800 GB. ASICs and FPGAs will be used in the first two generations.
It was announcing the availability of a new version of its Goya inference and Gaudi training chips. Intel intends to manufacture them using their seven-nanometer manufacturing technology, which will allow for a significant increase in performance by reinforcing the subsystems in the accelerators, as well as adding ethernet integration and other enhancements.
With Gaudi 2, they’re going all the way to seven nanometers and using that to improve all of the accelerator’s major subsystems.
