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Last Updated: Apr 25, 2025 | Study Period: 2022-2027
The defense, aerospace, and energy industries rely heavily on radiation hardening, often known as "rad hardening," and radiation survivability testing.
Radiation hardening is the process of creating radiation-tolerant electronics and components that can withstand high levels of ionising radiation, such as cosmic outer space radiation, X-ray radiation in medical or security settings, and high-energy radiation in nuclear power plants.
Radiation-hardened electronics manufacturers conduct rigorous testing as part of their product manufacturing procedures to test these components and decide whether they are properly hardened.
Components that pass these tests go into production and are referred to as "radiation-hardened," while those that fail do not need to be redesigned.
The North America Radiation-Hardened Electronics Market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2026, registering a CAGR of XX% from 2022 to 2027.
The PE97640 is an ultra-low phase noise FRAC-N phase-locked loop (PLL) for commercial space applications from e2v, a global leader in high-reliability semiconductors, and Peregrine Semiconductor Corp., a pioneer of advanced RF technologies.
The PE97640 is the first new space product available exclusively through e2v since the two companies signed a strategic reseller relationship in February. e2v will produce and qualify the PE97640, which is based on Peregrine's radiation-tolerant UltraCMOS® technology.
With the planned acquisition of Maxwell Microelectronics, a division of Maxwell Technologies, Inc., DDC (Data Device Corporation) will expand its space solutions capabilities.
For more than two decades, Maxwell Microelectronics has produced space-qualified radiation-tolerant and radiation-shielded products to the space sector, including semiconductors and single-board computers.
For greater performance and excellent dependability in aircraft applications, Maxwell's radiation mitigated power modules, memory modules, and single board computers use powerful commercial silicon.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2027 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2027 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2027 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2027 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |