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Last Updated: Apr 25, 2025 | Study Period: 2022-2030
The connector for an optical backplane module is made up of an insert and a connector shell. To facilitate alignment of the MT ferrule mating interfaces, the shell is created to give a float for the insert in both the X- and Y-directions.
A circuit board containing a collection of optical connectors connected in parallel to one another, allowing each connector's signal connections to be connected via optical connectivity, is known as an optical backplane.
This unique kind of printed circuit board, also known as a backplane, serves as a support structure for connecting additional PCBs and is frequently referred to as just a backplane.
The backplane connector functions as a plane for integrating additional system parts known as daughterboards while also adding mechanical strength and stability.
The Global optical backplane module connector market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Increasing processing power and open standards created by industry-government cooperation are driving the demand for new optical backplane technology.
In order to advance optical backplanes for OpenVPX systems, VITA 66.5 was developed. It is possible to create more board space and do away with the need for fiber wire by moving the fiber optic transceiver from the mid-board to the backplane connector.
This makes blind-mate plug-in cards easier to assemble and maintain. Additionally, VITA 66.5 enhances fiber density on the backplane, which boosts data throughput per square inch.
The inherent benefits of size, weight, and power consumption (SWaP) as well as the eradication of channel interference are also provided by adding more fiber optics to the system.
A novel kind of active, optical backplane is used in this evaluation of the OpenVPX/VITA 66.5 standard, which specifies embedded, military sensing and computing systems.
Ruggedized aerial, ground, and naval platforms will benefit greatly from these advancements in lifecycle management, maintenance, and SWaP (size/weight/power).
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |