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Last Updated: Apr 25, 2025 | Study Period: 2023-2030
Packaged IC Inspection and Metrology Systems.The ICOS T3/T7 Series provides increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of issues that affect final package quality.
Global packaged ic inspection system market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
TeraView launch a new product to address the growing needs in advanced IC packaging.TeraView is pleased to announce the launch of the purpose-built integrated circuit package inspection system, the EOTPR 4500.
Semiconductor Product and Applications Manager at TeraView commented âThe key feature of the EOTPR 4500 is the auto prober technology we developed to meet the challenges of the most advanced IC packaging technology by accommodating the substrate size of up to 150mmx150mm while improving the probe tip placement accuracy to +/- 0.5 µm.
The new auto probe enables our customers to probe very large chip-let devices with the landing contact size of less than 5 µm such as copper pillars and TSV tips. We closely collaborated with a major advanced packaging customer to develop this product, and the product has completed a rigorous beta site testing period at this customer site to ensure that the new product is production ready.
âTeraViewâs VP of Semiconductor Business, commented âWe have realised most of the probe stations are inadequate to meet the demand of the IC packaging probing which is quite different from the wafer probing since wafer surfaces are completely flat.
What this means is that the wafer based probe stations can crush or stress the probing points such as TSVs, or they need to land the probe tip painfully slow to avoid introducing artefacts into the target sample.
This product enables our customers to isolate faults in their most advanced IC packaging devices while taking advantage of EOTPRâs industry leading sub-5 µm distance-to-defect capability.
It also offers a device under test (DUT) heater that goes up to 250 °C, which means a customer who is working on advanced graphics engines or autonomous driving AI engines can now isolate faults on their devices while simulating the working conditions of these devices.â
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2023-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2023-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2023-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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