Global Packaged IC Inspection System Market 2023-2030
  • CHOOSE LICENCE TYPE
Consulting Services
    How will you benefit from our consulting services ?

Global Packaged IC Inspection System Market 2023-2030

Last Updated:  Apr 25, 2025 | Study Period: 2023-2030

GLOBAL PACKAGED IC INSPECTION SYSTEM MARKET 

 

INTRODUCTION

 Packaged IC Inspection and Metrology Systems.The ICOS T3/T7 Series provides increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of issues that affect final package quality.

 

GLOBAL PACKAGED IC INSPECTION SYSTEM MARKET SIZE AND FORECAST

 

Infographic: Packaged IC Inspection System Market , Packaged IC Inspection System Market Size, Packaged IC Inspection System Market Trends, Packaged IC Inspection System Market Forecast, Packaged IC Inspection System Market Risks, Packaged IC Inspection System Market Report, Packaged IC Inspection System Market Share

 

 

Global packaged ic inspection system market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

 

NEW PRODUCT LAUNCH

TeraView launch a new product to address the growing needs in advanced IC packaging.TeraView is pleased to announce the launch of the purpose-built integrated circuit package inspection system, the EOTPR 4500.

 

Semiconductor Product and Applications Manager at TeraView commented “The key feature of the EOTPR 4500 is the auto prober technology we developed to meet the challenges of the most advanced IC packaging technology by accommodating the substrate size of up to 150mmx150mm while improving the probe tip placement accuracy to +/- 0.5 µm. 

 

The new auto probe enables our customers to probe very large chip-let devices with the landing contact size of less than 5 µm such as copper pillars and TSV tips.  We closely collaborated with a major advanced packaging customer to develop this product, and the product has completed a rigorous beta site testing period at this customer site to ensure that the new product is production ready.

 

”TeraView’s VP of Semiconductor Business, commented “We have realised most of the probe stations are inadequate to meet the demand of the IC packaging probing which is quite different from the wafer probing since wafer surfaces are completely flat.

 

What this means is that the wafer based probe stations can crush or stress the probing points such as TSVs, or they need to land the probe tip painfully slow to avoid introducing artefacts into the target sample.

 

This product enables our customers to isolate faults in their most advanced IC packaging devices while taking advantage of EOTPR’s industry leading sub-5 µm distance-to-defect capability.

 

It also offers a device under test (DUT) heater that goes up to 250 °C, which means a customer who is working on advanced graphics engines or autonomous driving AI engines can now isolate faults on their devices while simulating the working conditions of these devices.”

 

COMPANY PROFILE

 

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

  1. How many packaged ic inspection system are manufactured per annum globally? Who are the sub-component suppliers in different regions?
  2. Cost breakup of a Global packaged ic inspection system and key vendor selection criteria
  3. Where is the packaged ic inspection system manufactured? What is the average margin per unit?
  4. Market share of Global packaged ic inspection system market manufacturers and their upcoming products
  5. Cost advantage for OEMs who manufacture Global packaged ic inspection system in-house
  6. key predictions for next 5 years in Global packaged ic inspection system market
  7. Average B-2-B packaged ic inspection system market price in all segments
  8. Latest trends in packaged ic inspection system market, by every market segment
  9. The market size (both volume and value) of the packaged ic inspection system market in 2023-2030 and every year in between?
  10. Production breakup of packaged ic inspection system market, by suppliers and their OEM relationship
Sl noTopic
1Market Segmentation
2Scope of the report
3Abbreviations
4Research Methodology
5Executive Summary
6Introduction
7Insights from Industry stakeholders
8Cost breakdown of Product by sub-components and average profit margin
9Disruptive innovation in the Industry           
10Technology trends in the Industry
11Consumer trends in the industry
12Recent Production Milestones
13Component Manufacturing in US, EU and China
14COVID-19 impact on overall market
15COVID-19 impact on Production of components
16COVID-19 impact on Point of sale
17Market Segmentation, Dynamics and Forecast by Geography, 2023-2030
18Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030
19Market Segmentation, Dynamics and Forecast by Application, 2023-2030
20Market Segmentation, Dynamics and Forecast by End use, 2023-2030
21Product installation rate by OEM, 2023
22Incline/Decline in Average B-2-B selling price in past 5 years
23Competition from substitute products
24Gross margin and average profitability of suppliers
25New product development in past 12 months
26M&A in past 12 months
27Growth strategy of leading players
28Market share of vendors, 2023
29Company Profiles
30Unmet needs and opportunity for new suppliers
31Conclusion
32Appendix