GLOBAL PANEL LEVEL PLATING EQUIPMENT MARKET

INTRODUCTION

The gear and tools used in the panel-level manufacture of printed circuit boards (PCBs) are referred to as panel level plating equipment. PCBs are crucial parts that offer electrical connections between various components in electronic equipment.

Panel-sized PCBs can be plated or metallized using equipment that is specifically made for that purpose. The PCBs' conductive pathways, which permit the transfer of electrical signals and power between various components, must be created using this plating technique.

The plating apparatus typically consists of a number of parts and procedures, including:

• The panel-sized PCBs are coated with a thin layer of conductive material, such as copper, using the electroless plating technique. It is carried out without the use of an external power source utilising a chemical bath.
• Using an electric current, a layer of metal, often copper, is deposited onto the PCB panels during the electroplating process. This procedure improves the PCB's conductivity even further.
• Panel handling systems: These systems are in charge of moving the panels between different plating stages. They guarantee that the panels are positioned and aligned correctly during plating.
• Tanks for plating: The plating solutions used for the electroless and electroplating processes are kept in these tanks. To obtain the desired plating thickness, the panels are submerged in these tanks for a set amount of time.
• Rinse systems: After plating, the panels go through steps of rinsing to get rid of any impurities or leftover plating solution. Rinse systems provide complete panel cleaning.
• Drying systems are used to remove extra water from the plated panels once the rinsing procedure is finished. To stop corrosion and preserve the plating's quality, this step is essential.
• Panel level plating equipment may additionally have inspection and quality control features to find any flaws or irregularities in the plating procedure. These systems guarantee that the finished PCB panels adhere to the necessary standards and requirements.

The ability to deposit conductive materials onto panel-sized boards, which facilitates the appropriate operation of electronic devices, is one of the key functions of panel level plating equipment in the fabrication of high-quality PCBs.

GLOBAL PANEL LEVEL PLATING EQUIPMENT MARKET SIZE AND FORECAST

The Global Panel Level Plating Equipment market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

NEW PRODUCT LAUNCH

The newest panel level plating techniques from Atotech, including Multiplate, Novabond, AgPrep, and equipment solutions for high resolution pattern plating, will be introduced, according to the company.

Atotech's ground-breaking plating tool, MultiPlate®, enables wafer and panel level packing in dimensions up to 650 x 610 mm. Its double-sided plating capacity offers better warpage adjustment while ensuring that plating happens at the highest current densities and producing good uniformity of the plated structures.

The adaptability and utility of MultiPlate® help meet present and upcoming difficulties for the best performance in advanced packaging technologies.Atotech's unique and cutting-edge adhesion promoter for sophisticated package substrates is called NovaBond® EX.

The horizontal approach offers customers a distinct and dependable method for solder resist and inner layer bonding materials with a seamless interface of about 150 nm Ra. For greater production, the quick process uses low temperatures and brief dwell times. According to their future technology roadmaps, the primary materials used or planned by major OEMs are compatible with NovaBond® EX.

The best non-etching adhesion promoter for the lead frame sector is AgPrep from Atotech. The adherence of all frequently employed molding compounds (EMC) to silver surfaces in semiconductor and LED package is significantly improved. AgPrep does not significantly alter the silver surface's initial performance.

COMPANY PROFILE

• Atotech
• Technic Inc.
• Applied Materials
• JCU Corporation
• Semitool, a KLA company
• Nordson MARCH

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Panel Level Plating Equipment are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Panel Level Plating Equipment and key vendor selection criteria
3. Where is the Panel Level Plating Equipment manufactured? What is the average margin per unit?
4. Market share of Global Panel Level Plating Equipment market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Panel Level Plating Equipment in-house
6. key predictions for next 5 years in Global Panel Level Plating Equipment market
7. Average B-2-B Panel Level Plating Equipment market price in all segments
8. Latest trends in Panel Level Plating Equipment market, by every market segment
9. The market size (both volume and value) of the Panel Level Plating Equipment market in 2023-2030 and every year in between?
10. Production breakup of Panel Level Plating Equipment market, by suppliers and their OEM relationship