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Last Updated: Apr 25, 2025 | Study Period: 2023-2030
As the density of PCB assemblies increases and miniaturization reduces the size of electronic components, it becomes even more important that solder paste deposition and volume transfer during the printing process is consistently reproducible from board to board. Many factors can adversely affect these important properties.
For example, good solder paste transfer efficiency is especially important for small pads as it reduces defects due to poor solder joints. In this case, over time solder paste will build up on the walls of the aperture and the bottom of the stencil.
resulting in poor or uneven transfer to the pad. Regular cleaning of accumulated paste with a Proper cleaning solution designed for your application will improve print quality and process yield.
Global PCB Stencil Cleaning Agent market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
ZESTRON is proud to introduce VIGON® SC 200 Stencil Cleaner Wipes to the market as a new product. ZESTRON is a leading global producer of high-precision cleaning products, services.
and training solutions in the electronics manufacturing and semiconductor sectors. An effective and secure substitute for alcohol-based cleaners is made possible by a potent combination of low-lint wiping materials and robust stencil chemistry.
To physically remove solder pastes and adhesives during electronic assembly manufacture, VIGON® SC 200 Stencil Cleaner Wipes are designed. They offer great cleansing while preserving operator safety because of the water-based chemical formulation.
The polyester non-woven wipes boost cleaning technique consistency, reduce discoloration and lint left behind on your stencil, and give outstanding wet strength.
They are appropriate substitutes for alcohol-based cleansers, compatible with nano-coated stencils, and advised for usage both manually and before automatic cleaning operations.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |