Global PCIe BGA SSD Market 2023-2030
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Global PCIe BGA SSD Market 2023-2030

Last Updated:  Apr 25, 2025 | Study Period: 2023-2030

GLOBAL PCIe BGA SSD MARKET

 

INTRODUCTION

PCIe BGA SSDs are a type of solid-state drive that use a ball grid array (BGA) to connect the drive to the system. These drives are designed to be fast and reliable, with high levels of performance and data integrity. They are typically used in enterprise applications, where speed and reliability are paramount.

 

The PCIe BGA SSDs use the BGA connection to provide a direct connection from the drive to the system. This connection is much faster than a conventional SATA connection and can provide a much higher level of performance. The BGA connection also eliminates the need for a PCIe bridge chip, further increasing the speed of the connection.

 

The PCIe BGA SSDs are also much more reliable than conventional SSDs. They use a smaller form factor and have fewer moving parts, making them less prone to failure. Additionally, the direct connection to the system allows for more consistent data transfer rates, as there is no need to wait for a bridge chip to process the data.

 

Finally, the PCIe BGA SSDs are much more power efficient than their conventional counterparts. This means that they can provide more performance with less power, resulting in lower energy costs.Overall, the PCIe BGA SSDs are a great choice for any enterprise application.

 

They provide high levels of performance, reliability, and power efficiency, making them an ideal choice for any data-intensive task.

 

GLOBAL PCIe BGA SSD MARKET SIZE AND FORECAST

 

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 The Global PCIe BGA SSD market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

 

RECENT DEVELOPMENT

 

BIWIN Technology introduced a novel PCIe BGA SSD+LPDDR4X storage solution for ARM TM servers that addresses the SOC platform's storage protocol constraints and enhances the usability of mobile apps.

 

The BIWIN EP400 PCIe BGA SSD has a capacity of up to 1TB and a high-speed PCIe 4.0 x 2 interface that allows it to give up to 3500 MB/s read and 3300 MB/s write speeds. Its dimensions are only 11.5 mm (L) x 13 mm.

 

This BIWIN EP400, when combined with LPDDR4X, operates at up to 4266 Mbps and has a 64 GB capacity. Furthermore, BIWIN introduced the PCIe 3.0 x 2 interface and NVMe 1.3 with the EP310 series.

 

The EP310 can read and write at maximum speeds of up to 1600 MB/s and 1300 MB/s, respectively, while only measuring 16 mm (L) by 20 mm (W). The high-end Rockchip RK3588 SoC is also compatible with it. BIWIN delivers cutting-edge storage solutions that are renowned for their outstanding performance, large capacities, smaller size, lower power consumption, and lower Total Cost of Ownership (TCO)—all of which enhance the user experience with mobile applications.

 

This is made possible by the company's decades of experience in its own chip packaging and testing facilities. Because of its power efficiency, mobile devices can be always connected and on. This is one well-known advantage of the ARMTM architecture. At the heart of the biggest computational ecosystem globally is ARMTM.

 

ADATA Introduced TheUSP33F, a New PCIe BGA SSD Designed for Tablets and Mini PCs Among Other Devices.  Compared to M.2 2242 SSDs, the SSD has an 80 percent smaller form factor.

 

The IUSP 33F is the perfect option for thin clients, mini-PCs, notebooks, tablets with small form factors, hybrid computers, and wearable technology since it has a PCIe Gen3x2 interface and 3D Flash memory for superior performance and durability.

 

The IUSP33F is an SSD that reflects the increasing popularity of 3D Flash and manufacturing advances, which are making SSDs lighter and more compact. The IUSP33F has a profile similar to eMMC memory because of its small 11.5 x 13 mm BGA package and NAND Flash.

 

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

  1. How many PCIe BGA SSD are manufactured per annum globally? Who are the sub-component suppliers in different regions?
  2. Cost breakup of a Global PCIe BGA SSD and key vendor selection criteria
  3. Where is the PCIe BGA SSD manufactured? What is the average margin per unit?
  4. Market share of Global PCIe BGA SSD market manufacturers and their upcoming products
  5. Cost advantage for OEMs who manufacture Global PCIe BGA SSD in-house
  6. key predictions for next 5 years in Global PCIe BGA SSD market
  7. Average B-2-B PCIe BGA SSD market price in all segments
  8. Latest trends in PCIe BGA SSD market, by every market segment
  9. The market size (both volume and value) of the PCIe BGA SSD market in 2023-2030 and every year in between?
  10. Production breakup of PCIe BGA SSD market, by suppliers and their OEM relationship

 

Sl no Topic 
Market Segmentation 
Scope of the report 
Abbreviations 
Research Methodology 
Executive Summary 
Introdauction 
Insights from Industry stakeholders 
Cost breakdown of Product by sub-components and average profit margin 
Disruptive innovation in theIndustry 
10 Technology trends in the Industry 
11 Consumer trends in the industry 
12 Recent Production Milestones 
13 Component Manufacturing in US, EU and China 
14 COVID-19 impact on overall market 
15 COVID-19 impact on Production of components 
16 COVID-19 impact on Point of sale 
17 Market Segmentation, Dynamics and Forecast by Geography, 2023-2030 
18 Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030 
19 Market Segmentation, Dynamics and Forecast by Application, 2023-2030 
20 Market Segmentation, Dynamics and Forecast by End use, 2023-2030 
21 Product installation rate by OEM, 2023 
22 Incline/Decline in Average B-2-B selling price in past 5 years 
23 Competition from substitute products 
24 Gross margin and average profitability of suppliers 
25 New product development in past 12 months 
26 M&A in past 12 months 
27 Growth strategy of leading players 
28 Market share of vendors, 2023 
29 Company Profiles 
30 Unmet needs and opportunity for new suppliers 
31 Conclusion 
32 Appendix