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Last Updated: Apr 25, 2025 | Study Period: 2022-2030
A serial connection called PCI Express functions more like a network than a bus. The PCIe interface contains a switch that manages a number of point-to-point serial connections rather than a single bus that handles data from several sources.
A computer can be connected to one or more peripheral devices using the serial expansion bus standard known as Peripheral Component Interconnect Express (PCIe or PCI-E). Compared to parallel buses like PCI and PCI-X, PCIe offers lower latency and faster data transfer speeds.
Redrivers are usually analogue reach extension devices that are used to increase high-frequency sections of signals in order to overcome the frequency-dependent attenuation brought on by the interconnect, which includes the system board, connections, CPU package, and other components.
The Global PCIe Redriver market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Phison announces the world's first PCI-SIG certified PCIe 5.0 Redriver IC was successfully deployed. Achieving PCI-SIG Certification, Phison's PCIe 5.0 Redriver IC PS7101 aims to address the compatibility issues with high-speed transmission between CPU and peripheral devices.
The world's first PCIe 5.0 Redriver IC PS7101, approved by the PCI-SIG Association, has been successfully deployed by a top provider of NAND controller and NAND storage solutions integration services, in an effort to address the issues with high-speed signal transmission between CPUs (Central Processing Units) and peripheral devices (such as SSD and graphics card, etc.).
Redriver ICs will be necessary in gadgets including desktop PCs, servers, industrial computers, cables, and notebook computers for PCIe 5.0 high-speed transmission. Each system device will need 2 to 16 Redriver ICs, depending on the level of signal attenuation and the quantity of compensation channels.
Demand for high-speed data transmission is on the rise as huge data, artificial intelligence, and cloud computing continue to advance rapidly. The key component of high-speed signal transmission is the CPU.
Under the direction of CPU chip manufacturers like Intel and AMD, the system's transmission interface has transitioned to PCIe 5.0, with single-lane transmission speeds exceeding 32 Gbps per second, or twice as fast as PCIe 4.0.
But in the PCIe 5.0 high-speed transmission environment, compatibility problems such signal attenuation and noise impacts on the motherboard have turned into widespread issues and difficulties that are confronted by all system integrators.
One of the few IC firms with the capacity to independently build PCIe 5.0 PHY physical layer IP, Phison is dedicated to the research and development of high-speed transmission interface technology. The PCIe 5.0 Redriver IC PS7101 adopts Flip-Chip packaging and testing technology to reduce signal reflection and crosstalk interference caused by IC packaging, while also improving the IC's capacity to dissipate heat.
This effectively addresses the issue of signal attenuation of high-speed transmission between the PC motherboard and the server platform or the riser card. It is an inexpensive IC device with strong gain and linearity.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |