PLASMA DICER MARKET

INTRODUCTION

 Plasma dicing is distinguished from blade dicing in that no wafer is chipped, the dicing width is decreased to about 1/3 of what it would be with blade dicing technology, and more chips, depending on chip size, are created.

Plasma dicing is a manufacturing technique that performs dry etching under vacuum to divide wafers into die (singulation). The semiconductor market is growing more and more interested in plasma dicing.

As dies get smaller and thinner, producers encounter challenges including rising material loss caused by the dicing line's width, mechanical damage from chipping, and rising processing times brought on by mechanical dicing done line-by-line.

PLASMA DICER MARKET SIZE AND FORECAST

 The global Plasma Dicer market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

PLASMA DICER MARKET NEW PRODUCT LAUNCH

IBM Japan, Ltd. and Panasonic Corporation's subsidiary, Panasonic Smart Factory Solutions Co., Ltd., announced their agreement to work together to create and market a new high-value system that will improve customers' semiconductor manufacturing processes' overall equipment effectiveness (OEE) and enable high-quality manufacturing.

Panasonic now creates and sells cutting-edge products and manufacturing processes as part of its circuit formation process business that help to promote semiconductor manufacture of advanced packaging.

These innovative tools and techniques include high-precision bonding tools, plasma dicers to create high-quality wafers, plasma cleaners to improve metal and resin adherence, and dry etching equipment.

In order to assist Panasonic in developing smart factory technologies, this knowledge will be coupled with methods and tools created by IBM Japan for the semiconductor manufacturing industry. These comprise an upper-layer manufacturing execution system (MES), advanced process control (APC), fault detection and classification (FDC), and data analysis systems.

These systems enhance quality and automate production management in semiconductor manufacturing operations. IoT and 5G gadgets have been getting quicker, smaller, and more versatile recently.

This has led to the development of manufacturing that is based on advanced packaging technology, in which a middle-end process has been added between the front-end and back-end processes in semiconductor manufacturing (combining the wafer process from the front-end process and the packaging technology from the back-end process).

PLASMA DICER MARKET COMPANY PROFILES

• ABM company S.r.l.
• Alistar Europe 
• Amisy 
• Cabinplant A/S 
• CAD PROJECT S.R.L. 
• Dadaux SAS 
• Diicma 
• FAM nv 
• FMT - Food Processing Technology 
• FOODLOGISTIK Fleischereimaschinen GmbH 
• Grasselli S.p.A. 
• IRE-KOREA 

THIS PLASMA DICER MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Plasma Dicer are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Plasma Dicer and key vendor selection criteria
3. Where is the Plasma Dicer manufactured? What is the average margin per unit?
4. Market share of Global Plasma Dicer market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Plasma Dicer in-house
6. key predictions for next 5 years in Global Plasma Dicer market
7. Average B-2-B Plasma Dicer market price in all segments
8. Latest trends in Plasma Dicer market, by every market segment
9. The market size (both volume and value) of the Plasma Dicer market in 2024-2030 and every year in between?
10. Production breakup of Plasma Dicer market, by suppliers and their OEM relationship