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Last Updated: Apr 26, 2025 | Study Period: 2022-2030
A carrier that can be used with several BGA package versions is called a BGA substrate. The BGA substrate must offer a variety of connecting pins to accommodate complex devices like microprocessors. It can also be difficult to design the pins and integrate them into the BGA substrate package.
When strong electrical and thermal requirements are a top priority, BGA are frequently employed in high-performance applications. BGAs come in tape, ceramic, and plastic varieties of materials. Both the plastic and thermally improved BGA are commonly used
The Global Plastic BGA Thin Substrate market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Government-imposed lockdowns following the COVID-19 outbreak have caused packaging manufacturers to halt production, disrupting the supply chain for the entire chip manufacturing and supply sector.
The demand for products powered by semiconductor devices has decreased as a result of the COVID-19 epidemic. Due to the lockdown situation, component manufacture has stopped. The worldwide BGA packaging market's whole supply chain has been disrupted as a result.
On the other hand, the BGA packaging industry anticipates a chance amid the exceptional crisis as businesses start to allow remote work and end consumers start to consume more material on digital platforms. This affects the significance of storage and memory solutions for data centres, laptops, and other devices, such as small, inexpensive, and powerful packed ICs.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |