PLASTIC DUAL-IN-LINE PACKAGING MARKET REPORT

INTRODUCTION

DIP packaging, commonly referred to as plastic dual-in-line packaging, is a type of packaging used for electronic components like integrated circuits (ICs).

A rectangular plastic body with two rows of pins that protrude from the bottom make up DIP packages. The pins are used to attach the component to a printed circuit board and are spaced at a standard distance of 0.1 inches (2.54 mm) (PCB).

ICs were originally often packaged in DIP packages, but more efficient packaging formats, such surface-mount technology (SMT) packages, have largely taken their place. DIP packages are still utilized, nonetheless, for some applications, particularly in educational and hobbyist projects where accessibility and cost are more crucial than downsizing.

The conventional 300-mil DIP, the smaller 150-mil DIP, and the larger 600-mil DIP are three different kinds of plastic DIP packaging. A wide range of components can be packaged in DIP format because each kind has a varied pin count and pin spacing.

PLASTIC DUAL-IN-LINE PACKAGING MARKET SIZE AND FORECAST

Global plastic dual-in-line packaging market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

PLASTIC DUAL-IN LINE PACKAGING MARKET NEW PRODUCT LAUNCH

As more industries may experience obsolescence, Rochester Electronics has established a Plastic Dual Inline Package (PDIP) assembly line to meet the growing demand for this service.

In order to accommodate new IC dies that required an increasing number of pins in order to function as usable parts, the PDIP design was developed in 1964.

The dual in-line package (DIP), now commonplace, was used to package the first commercially significant integrated circuits and was successful for more.

Multiple designers can collaborate on the same design in real time using concurrent engineering and distributed design. Reduces the bulk of your layout design cycle.80% faster routing of advanced high-speed interfaces.

Multiple designers can work simultaneously on the same design on the same canvas thanks to its shared canvas, which offers a low-overhead environment without the need for a partitioned project's setup. Your team can complete routing more quickly the more routing engineers you add.

PLASTIC DUAL-IN LINE PACKAGING MARKET KEY PLAYERS

• Infineon Technologies
• Fairchild Semiconductor
• Vishay Intertechnology
• NXP Semiconductors
• STMicroelectronics
• Microchip Technology
• ON Semiconductor
• Texas Instruments

THIS PLASTIC DUAL-IN LINE PACKAGING MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many plastic dual-in-line packaging are manufactured per annum globally?
2. Who are the sub-component suppliers in different regions?
3. Cost breakup of a Global plastic dual-in-line packaging and key vendor selection criteria?
4. Where is the plastic dual-in-line packaging manufactured?
5. What is the average margin per unit?
6. Market share of Global plastic dual-in-line packaging market manufacturers and their upcoming products?
7. Cost advantage for OEMs who manufacture Global plastic dual-in-line packaging in-house.
8. key predictions for next 5 years in Global plastic dual-in-line packaging market?
9. Average B-2-B plastic dual-in-line packaging market price in all segments?
10. Latest trends in plastic dual-in-line packaging market, by every market segment?
11. The market size (both volume and value) of the plastic dual-in-line packaging market in 2024-2030 and every year in between?
12. Production breakup of plastic dual-in-line packaging market, by suppliers and their OEM relationship?