GLOBAL PLASTIC ENCAPSULATED SEMICONDUCTOR CHIPS MARKET

INTRODUCTION

The description of a chip carrier type plastic encapsulation for a semiconductor integrated circuit. The kit contains a lead frame member for reel-to-reel automatic processing made from a continuous metal tape. The lead frame member provides all necessary connections between electrodes on the semiconductor chip's active or front surface and contact parts outside of the encapsulation.

The rear surface of the semiconductor chip is electrically and thermally connected to the lead frame member's integral backside contact members. Similar to the front contact parts, the rear contact members are a part of the moulded plastics enclosing body.

A high degree of automation fabrication is possible for the package, including handling in stick-type magazines for later processes like testing, ageing, and assembly. The package can be produced in very small sizes. 

GLOBAL PLASTIC ENCAPSULATED SEMICONDUCTOR CHIPS MARKET SIZE AND FORECAST

The Global plastic encapsulated semiconductor chips market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.

MARKET DYNAMICS

In the UK, lter Technology has begun mass producing plastic-encapsulated QFN chip packages.The Alter UK plant in Livingston, Scotland, offers a crucial capability in the UK as the majority of semiconductor packaging is done in big outsourced assembly and test (OSAT) production lines in Asia.

There are just a few facilities in Europe having this capability, and Alter is one of them.In the past, ceramic and metal packages were used for low-volume semiconductor packaging in the UK, and batch sizes were restricted to 100 or so devices manufactured serially. This is adequate for prototype and demanding settings but not ideal for the bulk of semiconductor packaging applications.

COMPANY PROFILE

• Shenzhen Jin Da Peng Technology Co.
• Samsung 
• Global Foundries
• UMC
• SK Hynix

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Plastic Encapsulated Semiconductor Chips are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Plastic Encapsulated Semiconductor Chips and key vendor selection criteria
3. Where are Plastic Encapsulated Semiconductor Chips manufactured? What is the average margin per unit?
4. Market share of Global Plastic Encapsulated Semiconductor Chips market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Plastic Encapsulated Semiconductor Chips in-house
6. key predictions for next 5 years in Global Plastic Encapsulated Semiconductor Chips market
7. Average B-2-B Plastic Encapsulated Semiconductor Chips market price in all segments
8. Latest trends in Plastic Encapsulated Semiconductor Chips market, by every market segment
9. The market size (both volume and value) of the Plastic Encapsulated Semiconductor Chips market in 2022-2030 and every year in between?
10. Production breakup of Plastic Encapsulated Semiconductor Chips market, by suppliers and their OEM relationship